Invention Grant
- Patent Title: Semiconductor devices and methods of making the devices
- Patent Title (中): 半导体器件和制造器件的方法
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Application No.: US10673459Application Date: 2003-09-30
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Publication No.: US06861294B2Publication Date: 2005-03-01
- Inventor: Shigeharu Tsunoda , Junichi Saeki , Isamu Yoshida , Kazuya Ooji , Michiharu Honda , Makoto Kitano , Nae Yoneda , Shuji Eguchi , Kunihiko Nishi , Ichiro Anjoh , Kenichi Otsuka
- Applicant: Shigeharu Tsunoda , Junichi Saeki , Isamu Yoshida , Kazuya Ooji , Michiharu Honda , Makoto Kitano , Nae Yoneda , Shuji Eguchi , Kunihiko Nishi , Ichiro Anjoh , Kenichi Otsuka
- Applicant Address: JP Tokyo
- Assignee: Renesas Technology Corp.
- Current Assignee: Renesas Technology Corp.
- Current Assignee Address: JP Tokyo
- Agency: Mattingly, Stanger & Malur, P.C.
- Priority: JP06-016105 19940210
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/31 ; H01L21/44

Abstract:
A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.
Public/Granted literature
- US20040063272A1 Semiconductor devices and methods of making the devices Public/Granted day:2004-04-01
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