公开(公告)号：US5539250A

公开(公告)日：1996-07-23

申请号：US713100

申请日：1991-06-11

Applicant: Makoto Kitano ,  Asao Nishimura ,  Akihiro Yaguchi ,  Ryuji Kohno ,  Nae Yoneda

Inventor： Makoto Kitano ,  Asao Nishimura ,  Akihiro Yaguchi ,  Ryuji Kohno ,  Nae Yoneda

IPC: H01L25/18 ,  H01L23/31 ,  H01L23/495 ,  H01L25/065 ,  H01L25/07 ,  H01L23/34

CPC classification number: H01L24/32 ,  H01L23/3135 ,  H01L23/4951 ,  H01L23/49555 ,  H01L23/49575 ,  H01L2224/29339 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/83191 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2224/92 ,  H01L2224/92147 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/181

Abstract: A plastic-molded-type semiconductor device is provided wherein two semiconductor chips, having main surfaces on which electrodes and circuits are formed, are arranged to face each other. A lead frame is placed between these two semiconductor chips and electrically connected to their electrodes, and a plastic package is formed by plastic-sealing the above components. To provide for secure and convenient electrical connections between the electrodes on the semiconductor chips and the lead frame, wiring patterns are provided on the main surfaces of the semiconductor chips through the intermediation of insulating films. With this structure, it is possible for two large-sized semiconductor chips having electrodes in their middle sections to be encased in a single, relatively thin package.

Abstract translation: 提供了一种塑料模制型半导体器件，其中具有形成有电极和电路的主表面的两个半导体芯片被布置成彼此面对。 引线框架放置在这两个半导体芯片之间并电连接到它们的电极，并且通过塑性密封上述部件形成塑料封装。 为了提供半导体芯片上的电极和引线框架之间的牢固和方便的电连接，布线图案通过绝缘膜设置在半导体芯片的主表面上。 利用这种结构，在其中间部分中具有电极的两个大尺寸半导体芯片可以被封装在单个相对薄的封装中。

公开(公告)号：US06686226B1

公开(公告)日：2004-02-03

申请号：US09562758

申请日：2000-05-02

Applicant: Shigeharu Tsunoda ,  Junichi Saeki ,  Isamu Yoshida ,  Kazuya Ooji ,  Michiharu Honda ,  Makoto Kitano ,  Nae Yoneda ,  Shuji Eguchi ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Otsuka

Inventor： Shigeharu Tsunoda ,  Junichi Saeki ,  Isamu Yoshida ,  Kazuya Ooji ,  Michiharu Honda ,  Makoto Kitano ,  Nae Yoneda ,  Shuji Eguchi ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Otsuka

IPC: H01L2144

CPC classification number: H01L24/97 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold, which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

Abstract translation: 一种半导体塑料封装，更具体地，优选的封装结构和用于制造BGA封装的方法。 树脂密封BGA封装，其中固定支撑半导体部件的支撑框架; 即IC芯片，电路板或电路膜用树脂密封，使用由上半模和下半模组成的模具，下半模具有多个突起，一个在 与每个外部端子对应的位置。 模具具有在其分割元件之间具有通风口的分隔结构。

公开(公告)号：US5569960A

公开(公告)日：1996-10-29

申请号：US438466

申请日：1995-05-10

Applicant: Tetsuo Kumazawa ,  Makoto Kitano ,  Akihiro Yaguchi ,  Ryuji Kohno ,  Naotaka Tanaka ,  Nae Yoneda ,  Ichiro Anjoh

Inventor： Tetsuo Kumazawa ,  Makoto Kitano ,  Akihiro Yaguchi ,  Ryuji Kohno ,  Naotaka Tanaka ,  Nae Yoneda ,  Ichiro Anjoh

IPC: H05K1/18 ,  H01L21/60 ,  H01L23/12 ,  H01L23/31 ,  H01L23/50 ,  H05K1/11 ,  H05K3/34 ,  H01L23/48

CPC classification number: H01L24/11 ,  H01L23/3128 ,  H05K3/3436 ,  H01L2224/13099 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/20752 ,  H05K1/11 ,  H05K1/111 ,  H05K2201/094 ,  H05K2203/0465 ,  H05K3/3431 ,  Y02P70/613

Abstract: An electronic component unit is provided with two electronic components which are disposed in parallel with each other and each of which has an internal electric circuit therein. Electrode pads are provided on the opposed surfaces of the two electronic components and are electrically connected to the internal electric circuits. The pads on one of the electronic components are respectively electrically and mechanically connected to the corresponding pads on the other electronic component by solder bumps. The areas of the pads increase or decrease stepwise in the direction from the central portions toward the outer peripheral edges of the two electronic components, while the volumes of the solder bumps are constant. Alternatively, the volumes of the solder bumps decrease or increase in the direction from the central portions toward the outer peripheral edges of the two electronic components, while the areas of all pads are constant. Each of the pads of the two electronic components is bonded to an associated solder bump over the whole area of the pad, whereby the shapes of the solder bumps respectively connected to the pads of the two electronic components change in the direction from the central portions toward the outer peripheral edges of the two electronic components to provide the solder bumps with different durabilities to stress, thereby assuring high reliability of the connection between the two electronic components.

Abstract translation: 电子部件单元设置有彼此并联布置的两个电子部件，每个电子部件在其中具有内部电路。 电极焊盘设置在两个电子部件的相对表面上并与内部电路电连接。 其中一个电子部件上的焊盘通过焊料凸块分别电连接和机械连接到另一电子部件上的对应的焊盘。 焊盘的面积在从两个电子部件的中心部分朝向外周边缘的方向上逐渐增加或减小，而焊料凸块的体积是恒定的。 或者，焊料凸块的体积在从两个电子部件的中心部分朝向外周边缘的方向上减小或增加，而所有焊盘的面积是恒定的。 两个电子部件的每个焊盘在焊盘的整个区域上结合到相关联的焊料凸块，由此分别连接到两个电子部件的焊盘的焊料凸块的形状在从中心部分朝向 两个电子部件的外周边缘，以使焊料凸块具有不同的应力耐久性，从而确保两个电子部件之间的连接的高可靠性。

公开(公告)号：US5347429A

公开(公告)日：1994-09-13

申请号：US68319

申请日：1993-05-28

Applicant: Ryuji Kohno ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Nae Yoneda

Inventor： Ryuji Kohno ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Nae Yoneda

IPC: H01L25/18 ,  H01L23/06 ,  H01L23/495 ,  H01L23/52 ,  H01L25/04 ,  H01L25/065 ,  H01L25/07 ,  H05K5/02

CPC classification number: H01L23/4951 ,  H01L23/49531 ,  H01L23/49575 ,  H01L24/49 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/49 ,  H01L2224/73215 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19107

Abstract: A plastic-molded-type semiconductor device includes a plurality of semiconductor chips, metallic wires connected to the semiconductor chips, leads connected to the metallic wires, and an insulating member interposed between the semiconductor chips and sealed in a resin member. Circuit formed surfaces of the semiconductor chips are directed in the same direction, and one or more of the semiconductor chips serve as a base on which the other semiconductor chips are mounted through the insulating member. One ends of the leads are bonded to the insulating member, and electrodes pad of each semiconductor chip are not covered by the other semiconductor chips, the insulating member and the leads, and therefore are exposed to the surface of the insulating member. In this device, the provision of a tab is omitted, and the laminated chips can be contained in a package thinner than a conventional package. Since the circuit formation surfaces of all of the chips are directed in the same direction, all of the electrical connections can be made by wire bonding from one direction.

Abstract translation: 塑料模制型半导体器件包括多个半导体芯片，连接到半导体芯片的金属线，连接到金属线的引线以及置于半导体芯片之间并被密封在树脂构件中的绝缘构件。 半导体芯片的电路形成表面指向相同的方向，并且一个或多个半导体芯片用作通过绝缘构件安装其它半导体芯片的基底。 引线的一端接合到绝缘构件，并且每个半导体芯片的电极焊盘不被其它半导体芯片，绝缘构件和引线覆盖，因此暴露于绝缘构件的表面。 在该装置中，省略了突片的设置，并且层压芯片可以被包含在比常规封装更薄的封装中。 由于所有芯片的电路形成表面指向相同的方向，所以所有的电连接都可以通过从一个方向引线接合而形成。

公开(公告)号：US5295045A

公开(公告)日：1994-03-15

申请号：US791551

申请日：1991-11-14

Applicant: Makoto Kitano ,  Asao Nishimura ,  Akihiro Yaguchi ,  Nae Yoneda ,  Maya Obata ,  Ryuji Kohno ,  Mitsuaki Haneda

Inventor： Makoto Kitano ,  Asao Nishimura ,  Akihiro Yaguchi ,  Nae Yoneda ,  Maya Obata ,  Ryuji Kohno ,  Mitsuaki Haneda

IPC: H01L23/28 ,  H01L23/495 ,  H01L23/50 ,  H01L23/52 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K5/02

CPC classification number: H01L23/49575 ,  H01L23/4951 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041

Abstract: A plastic-molded-type semiconductor device having a high degree of integration encases a plurality of semiconductor chips in a package unit with each chip situated perpendicular to the substrate for mounting. On a surface of each chip containing circuits or on a reverse surface of the same, a lead frame is attached with an insulating material interposed therebetween. The chip and lead frame are connected with each other by using wire. The lead frame is arranged perpendicularly to another lead frame provided in parallel and connected therewith by welding. A printed circuit board may be used in place of said latter lead frame. By arranging the chips in projections made of resin, the thermal resistance of the semiconductor device is decreased. The present invention is particularly effective for a memory IC.

Abstract translation: 具有高集成度的塑料模制型半导体器件将多个半导体芯片封装在封装单元中，每个芯片垂直于衬底设置用于安装。 在每个芯片容纳电路的表面上或其背面上，引线框架之间插入绝缘材料。 芯片和引线框架通过电线相互连接。 引线框架垂直布置成并联设置的另一引线框架，通过焊接与引线框架相连接。 可以使用印刷电路板代替所述后置引线框架。 通过将芯片布置在由树脂制成的突起中，半导体器件的热阻降低。 本发明对存储器IC特别有效。

公开(公告)号：US6114192A

公开(公告)日：2000-09-05

申请号：US114997

申请日：1998-07-14

Applicant: Shigeharu Tsunoda ,  Junichi Saeki ,  Isamu Yoshida ,  Kazuya Ooji ,  Michiharu Honda ,  Makoto Kitano ,  Nae Yoneda ,  Shuji Eguchi ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Otsuka

Inventor： Shigeharu Tsunoda ,  Junichi Saeki ,  Isamu Yoshida ,  Kazuya Ooji ,  Michiharu Honda ,  Makoto Kitano ,  Nae Yoneda ,  Shuji Eguchi ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Otsuka

IPC: H01L21/50 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L23/04 ,  H01L23/31 ,  H01L21/44 ,  H01L21/48

CPC classification number: H01L21/565 ,  H01L23/3107 ,  H01L23/3128 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181

Abstract: A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

Abstract translation: 一种半导体塑料封装，更具体地，优选的封装结构和用于制造BGA封装的方法。 树脂密封BGA封装，其中固定支撑半导体部件的支撑框架; 即IC芯片，电路板或电路膜用树脂密封，使用由上半模和下半模构成的模具，下半模具有多个突起，一个在 对应于每个外部端子的位置。 模具具有在其分割元件之间具有通风口的分隔结构。

公开(公告)号：US5608265A

公开(公告)日：1997-03-04

申请号：US207697

申请日：1994-03-09

Applicant: Makoto Kitano ,  Asao Nishimura ,  Akihiro Yaguchi ,  Nae Yoneda ,  Ryuji Kohno ,  Naotaka Tanaka ,  Tetsuo Kumazawa

Inventor： Makoto Kitano ,  Asao Nishimura ,  Akihiro Yaguchi ,  Nae Yoneda ,  Ryuji Kohno ,  Naotaka Tanaka ,  Tetsuo Kumazawa

IPC: H01L21/56 ,  H01L23/12 ,  H01L23/13 ,  H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L25/10 ,  H01L25/11 ,  H01L25/16 ,  H01L25/18 ,  H05K1/18 ,  H05K3/34 ,  H01L23/48 ,  H01L23/02 ,  H01L29/40

CPC classification number: H01L23/3107 ,  H01L21/565 ,  H01L23/13 ,  H01L23/4951 ,  H01L23/49541 ,  H01L25/105 ,  H01L25/16 ,  H05K1/181 ,  H05K3/3436 ,  H01L2224/16145 ,  H01L2224/16237 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H05K2201/09472 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10818 ,  H05K2201/10931 ,  H05K3/3426 ,  H05K3/3431 ,  Y02P70/611 ,  Y02P70/613

Abstract: A semiconductor device, provided in a plastic encapsulated package, having a semiconductor chip, a lead and a member for electrically connecting them together. The semiconductor device has one or more first holes respectively extending from one surface of the package to a first side of the lead which is provided inside of the package, and has one or more second holes formed which are aligned with the first holes, respectively, in a manner such that each second hole is extended from the opposing surface of the package to a corresponding location on a second side of the lead and is aligned with a corresponding, opposing first hole, in the package, extending to the first side of the lead. These holes are provided as a plurality of sets of individual pairs of aligned holes respectively extending inwardly, from opposing surfaces of the package, to opposite sides of the corresponding leads. In the device the leads or the leads with resin act as partitions thereby effecting isolation between the first and second holes of each pair aligned holes.

Abstract translation: 设置在塑料封装封装中的半导体器件具有半导体芯片，引线和用于将它们电连接在一起的部件。 半导体器件具有分别从封装的一个表面延伸到设置在封装内部的引线的第一侧的一个或多个第一孔，并且分别具有与第一孔对准的一个或多个第二孔， 以使得每个第二孔从包装的相对表面延伸到引线的第二侧上的对应位置并且与包装中的相应的相对的第一孔对准，延伸到包装的第一侧 铅。 这些孔被设置为多组对齐的对齐的孔，分别从包装的相对表面向内延伸到相应引线的相对侧。 在装置中，引线或具有树脂的引线作为隔板，从而实现每对对齐的孔的第一和第二孔之间的隔离。

公开(公告)号：US5357139A

公开(公告)日：1994-10-18

申请号：US117639

申请日：1993-09-08

Applicant: Akihiro Yaguchi ,  Asao Nishimura ,  Makoto Kitano ,  Ryuji Kohno ,  Nae Yoneda ,  Ichiro Anjoh ,  Gen Murakami

Inventor： Akihiro Yaguchi ,  Asao Nishimura ,  Makoto Kitano ,  Ryuji Kohno ,  Nae Yoneda ,  Ichiro Anjoh ,  Gen Murakami

IPC: H01L23/50 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L23/48

CPC classification number: H01L21/56 ,  H01L23/3142 ,  H01L23/49506 ,  H01L23/4951 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1815

Abstract: In a package for DRAM, plastic is included between the common signal inner leads (bus bar inner leads) and insulating films arranged in the central part of a semiconductor chip. Thus, the deformation of plastic at the upper edge of the common signal inner leads is reduced and no great stress is generated at this portion. Accordingly, plastic cracking can be prevented.

Abstract translation: 在用于DRAM的封装中，在公共信号内引线（母线内引线）和布置在半导体芯片的中心部分的绝缘膜之间包括塑料。 因此，在公共信号内引线的上边缘处的塑料变形减小，并且在该部分处不产生大的应力。 因此，可以防止塑性开裂。

公开(公告)号：US06861294B2

公开(公告)日：2005-03-01

申请号：US10673459

申请日：2003-09-30

Applicant: Shigeharu Tsunoda ,  Junichi Saeki ,  Isamu Yoshida ,  Kazuya Ooji ,  Michiharu Honda ,  Makoto Kitano ,  Nae Yoneda ,  Shuji Eguchi ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Otsuka

Inventor： Shigeharu Tsunoda ,  Junichi Saeki ,  Isamu Yoshida ,  Kazuya Ooji ,  Michiharu Honda ,  Makoto Kitano ,  Nae Yoneda ,  Shuji Eguchi ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Otsuka

IPC: H01L21/56 ,  H01L23/31 ,  H01L21/44

CPC classification number: H01L24/97 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

Abstract translation: 一种半导体塑料封装，更具体地，优选的封装结构和用于制造BGA封装的方法。 树脂密封BGA封装，其中固定支撑半导体部件的支撑框架; 即IC芯片，电路板或电路膜用树脂密封，使用由上半模和下半模组成的模具，下半模具有多个突起，一个在 对应于每个外部端子的位置。 模具具有在其分割元件之间具有通风口的分隔结构。

公开(公告)号：US5914531A

公开(公告)日：1999-06-22

申请号：US805737

申请日：1997-02-25

Applicant: Shigeharu Tsunoda ,  Junichi Saeki ,  Isamu Yoshida ,  Kazuya Ooji ,  Michiharu Honda ,  Makoto Kitano ,  Nae Yoneda ,  Shuji Eguchi ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Otsuka

Inventor： Shigeharu Tsunoda ,  Junichi Saeki ,  Isamu Yoshida ,  Kazuya Ooji ,  Michiharu Honda ,  Makoto Kitano ,  Nae Yoneda ,  Shuji Eguchi ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Otsuka

IPC: H01L21/50 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L23/04 ,  H01L23/31 ,  H01L23/495

CPC classification number: H01L21/565 ,  H01L23/3107 ,  H01L23/3128 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181

Abstract: A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

Abstract translation: 一种半导体塑料封装，更具体地，优选的封装结构和用于制造BGA封装的方法。 树脂密封BGA封装，其中固定支撑半导体部件的支撑框架; 即IC芯片，电路板或电路膜用树脂密封，使用由上半模和下半模构成的模具，下半模具有多个突起，一个在 对应于每个外部端子的位置。 模具具有在其分割元件之间具有通风口的分隔结构。