发明授权
- 专利标题: Semiconductor interconnect and method of providing interconnect using a contact region
- 专利标题(中): 半导体互连和使用接触区提供互连的方法
-
申请号: US10284761申请日: 2002-10-31
-
公开(公告)号: US06864582B1公开(公告)日: 2005-03-08
- 发明人: Vladislav Vashchenko , Peter J. Hopper , Philipp Lindorfer , Andy Strachan , Peter Johnson
- 申请人: Vladislav Vashchenko , Peter J. Hopper , Philipp Lindorfer , Andy Strachan , Peter Johnson
- 申请人地址: US CA Santa Clara
- 专利权人: National Semiconductor Corp.
- 当前专利权人: National Semiconductor Corp.
- 当前专利权人地址: US CA Santa Clara
- 代理商 Jurgen Vollrath
- 主分类号: H01L23/485
- IPC分类号: H01L23/485 ; H01L29/72
摘要:
In a semiconductor structure, interconnects between regions of a single device or different devices are achieved by forming contacts or plugs in thick oxide holes that span across the regions to be interconnected.
公开/授权文献
- US3096098A Chuck jaw construction 公开/授权日:1963-07-02
信息查询
IPC分类: