Invention Grant
- Patent Title: Distributed memory and logic circuits
- Patent Title (中): 分布式存储器和逻辑电路
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Application No.: US10422137Application Date: 2003-04-24
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Publication No.: US06870398B2Publication Date: 2005-03-22
- Inventor: James R. Brown , Charles A. Edmondson , Brian R. Kauffmann
- Applicant: James R. Brown , Charles A. Edmondson , Brian R. Kauffmann
- Applicant Address: US ID Pocatello
- Assignee: AMI Semiconductor, Inc.
- Current Assignee: AMI Semiconductor, Inc.
- Current Assignee Address: US ID Pocatello
- Agency: MacPherson Kwok Chen & Heid LLP
- Agent Greg J. Michelson
- Main IPC: G11C5/02
- IPC: G11C5/02 ; G11C5/06 ; G06F9/38

Abstract:
Systems and methods are disclosed for distributing memory within one or more regions of circuitry that perform logic functions (or other types of functions that require dense interconnect structures) on an integrated circuit. The distributed memory reduces high density routing congestion, allows increased logic utilization, and provides areas for additional interconnect structure. Various techniques are also disclosed for accessing the memory.
Public/Granted literature
- US20040212396A1 Distributed memory and logic circuits Public/Granted day:2004-10-28
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