- 专利标题: Moisture-curing adhesives
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申请号: US10303559申请日: 2002-11-25
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公开(公告)号: US06872770B2公开(公告)日: 2005-03-29
- 发明人: Pankaj Shah
- 申请人: Pankaj Shah
- 申请人地址: US PA Philadelphia
- 专利权人: Rohm and Haas Company
- 当前专利权人: Rohm and Haas Company
- 当前专利权人地址: US PA Philadelphia
- 代理商 Carl P. Hemenway
- 主分类号: B32B7/12
- IPC分类号: B32B7/12 ; C08G18/12 ; C08G18/40 ; C08G18/42 ; C08K3/36 ; C08L75/04 ; C08L83/04 ; C09J5/00 ; C09J5/06 ; C09J11/04 ; C09J175/04 ; C09J183/04 ; C09J201/00
摘要:
An improved urethane reactive hot-melt adhesive is provided that improves the green strength of bonded joints is provided. Also provided are an improved method of bonding articles together with such an adhesive and improved composite articles bonded together with such an adhesive.
公开/授权文献
- US20030109624A1 Moisture-curing adhesives 公开/授权日:2003-06-12