发明授权
- 专利标题： Method for detecting the reliability of integrated semiconductor components at high temperatures
- 专利标题（中）： 在高温下检测集成半导体元件的可靠性的方法
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申请号： US10751316申请日： 2004-01-02
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公开(公告)号： US06873170B2公开(公告)日： 2005-03-29
- 发明人: Wilhelm Asam , Josef Fazekas , Andreas Martin , David Smeets , Jochen Von Hagen
- 申请人： Wilhelm Asam , Josef Fazekas , Andreas Martin , David Smeets , Jochen Von Hagen
- 申请人地址： DE Munich
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Munich
- 代理商 Laurence A. Greenberg; Werner H. Stemer; Ralph E. Locher
- 优先权： DE10135805 20010723
- 主分类号： G01R31/28
- IPC分类号： G01R31/28 ; G01R31/3173 ; H01L23/544 ; G01R31/27
摘要：
The invention relates to a device and a method for detecting the reliability of integrated semiconductor components. The device includes a carrier substrate for receiving an integrated semiconductor component that will be examined, a heating element, and a temperature sensor. The temperature sensor has at least a portion of a parasitic functional element of the semiconductor component. As a result, reliability tests can be carried out in a particularly accurate and space-saving manner.
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