发明授权
- 专利标题： Cooling system for an electronic component
- 专利标题（中）： 电子元件冷却系统
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申请号： US10701727申请日： 2003-11-04
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公开(公告)号： US06880345B1公开(公告)日： 2005-04-19
- 发明人: Javier M. Leija , Christopher D. Lucero
- 申请人： Javier M. Leija , Christopher D. Lucero
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号： H01L23/34
- IPC分类号： H01L23/34 ; H01L23/38 ; F25B21/02
摘要：
A cooling system for an electronic component is provided. The cooling system includes a plurality of thermoelectric elements for placement above a plurality of different areas of the electronic component. The cooling system has a plurality of conductors connected to the thermoelectric elements for providing current to the thermoelectric elements, such that the thermoelectric elements pump heat away from the respective areas. The cooling system has a control apparatus connected to the conductors for controlling current provided to the thermoelectric elements relative to one another based on heat generated at the different areas.
公开/授权文献
- US20050091989A1 COOLING SYSTEM FOR AN ELECTRONIC COMPONENT 公开/授权日：2005-05-05
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