发明授权
US06881956B1 Method and apparatus for scanning semiconductor wafers using a scanning electron microscope
有权
使用扫描电子显微镜扫描半导体晶片的方法和装置
- 专利标题： Method and apparatus for scanning semiconductor wafers using a scanning electron microscope
- 专利标题（中）： 使用扫描电子显微镜扫描半导体晶片的方法和装置
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申请号： US10649599申请日： 2003-08-26
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公开(公告)号： US06881956B1公开(公告)日： 2005-04-19
- 发明人: Jack Y. Jau , Zhongwei Chen
- 申请人： Jack Y. Jau , Zhongwei Chen
- 申请人地址： TW Hsinchu
- 专利权人： Hermes-Microvision, Inc.
- 当前专利权人： Hermes-Microvision, Inc.
- 当前专利权人地址： TW Hsinchu
- 代理机构： Townsend and Townsend and Crew LLP
- 主分类号： G01N23/225
- IPC分类号： G01N23/225 ; G01N23/04
摘要：
An apparatus and method for scanning the surface of a specimen is disclosed for defect inspection purposes. Scanning Electron Microscope (SEM) is used to scan the surface of a specimen. The scanning method employed by the SEM comprises the steps of: generating a particle beam from a particle beam emitter, and scanning the surface of the specimen by bending the particle beam at an angle with respect to the surface of the specimen, wherein the particle beam traverses an angle that is not parallel or perpendicular to the orientation of the specimen. The specimen being scanned is a semiconductor wafer or a photomask.
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