发明授权
- 专利标题： Enhanced adhesion strength between mold resin and polyimide
- 专利标题（中）： 提高模具树脂和聚酰亚胺之间的粘合强度
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申请号： US10058473申请日： 2002-01-28
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公开(公告)号： US06884662B1公开(公告)日： 2005-04-26
- 发明人: Ken Chen , Chender Huang , Pei-Haw Tsao , Jones Wang , Hank Huang
- 申请人： Ken Chen , Chender Huang , Pei-Haw Tsao , Jones Wang , Hank Huang
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company
- 当前专利权人： Taiwan Semiconductor Manufacturing Company
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Thomas, Kayden, Horstemeyer & Risley
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/31 ; H01L21/44 ; H01L21/48 ; H01L21/50
摘要：
A new method is provided for the interface between a stress relieve interface layer of polyimide and a thereover created layer of mold compound. The invention provides for creating a pattern in the stress relieve layer of polyimide before the layer of mold compound is formed over the stress relieve layer of polyimide.
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