发明授权
- 专利标题: Semiconductor memory device and fabrication method thereof
- 专利标题(中): 半导体存储器件及其制造方法
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申请号: US10259871申请日: 2002-09-30
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公开(公告)号: US06885070B2公开(公告)日: 2005-04-26
- 发明人: Sang-Bai Yi , Jae-Min Yu , Sung-Chul Lee
- 申请人: Sang-Bai Yi , Jae-Min Yu , Sung-Chul Lee
- 申请人地址: KR Kyoungki-Do
- 专利权人: Hyundai Electronics Industries Co., Ltd.
- 当前专利权人: Hyundai Electronics Industries Co., Ltd.
- 当前专利权人地址: KR Kyoungki-Do
- 代理机构: Birch, Stewart, Kolasch & Birch, LLP
- 优先权: KR1999-16622 19990510
- 主分类号: H01L21/8247
- IPC分类号: H01L21/8247 ; H01L27/105 ; H01L27/115 ; H01L29/788 ; H01L29/792 ; H01L21/336 ; H01L29/76 ; H01L29/94
摘要:
In a semiconductor memory device including memory cells and a peripheral circuit unit, a memory cell has a first gate structure formed on a semiconductor substrate; a first impurity region of a first conductive type formed in the substrate on a first side of the gate structure; and a second impurity region formed in the substrate on a second side of the gate structure, the second impurity region including: a third impurity region of the first conductive type, a fourth impurity region of the first conductive type between the third impurity region and the second side of the gate structure, and a halo ion region of a second conductive type formed adjacent to the fourth impurity region.
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