发明授权
- 专利标题： Solder alloy and soldered bond
- 专利标题（中）： 焊接合金和焊接焊接
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申请号： US10356546申请日： 2003-02-03
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公开(公告)号： US06893512B2公开(公告)日： 2005-05-17
- 发明人: Masayuki Kitajima , Tadaaki Shono , Masakazu Takesue , Yutaka Noda
- 申请人： Masayuki Kitajima , Tadaaki Shono , Masakazu Takesue , Yutaka Noda
- 申请人地址： JP Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JP Kawasaki
- 代理机构： Armstrong, Kratz, Quintos, Hanson & Brooks, LLP
- 主分类号： B23K35/02
- IPC分类号： B23K35/02 ; B23K35/26 ; C22C13/00 ; H05K3/34
摘要：
A solder alloy having a solderability comparable to that of a conventional Pb—Sn solder alloy without having a detrimental effect on the environment and a soldered bond using the same. A solder alloy consisting of Zn: 4.0-10.0 wt %, In: 1.0 to 15.0 wt %, Al: 0.0020 to 0.0100 wt %, and the balance of Sn and unavoidable impurities. A soldered bond of an electric or electronic device composed of the above solder alloy.
公开/授权文献
- US20030143104A1 Solder alloy and soldered bond 公开/授权日：2003-07-31
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