发明授权
- 专利标题： Semiconductor device, semiconductor module and hard disk
- 专利标题（中）： 半导体器件，半导体模块和硬盘
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申请号： US10652184申请日： 2003-08-29
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公开(公告)号： US06894375B2公开(公告)日： 2005-05-17
- 发明人: Noriaki Sakamoto , Yoshiyuki Kobayashi , Junji Sakamoto , Yukio Okada , Yusuke Igarashi , Eiju Maehara , Kouji Takahashi
- 申请人： Noriaki Sakamoto , Yoshiyuki Kobayashi , Junji Sakamoto , Yukio Okada , Yusuke Igarashi , Eiju Maehara , Kouji Takahashi
- 申请人地址： JP Osaka
- 专利权人： Sanyo Electric Co., Ltd.
- 当前专利权人： Sanyo Electric Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： Fish & Richardson P.C.
- 优先权： JP2000-306670 20001005
- 主分类号： H01L23/28
- IPC分类号： H01L23/28 ; G11B5/48 ; H01L21/48 ; H01L23/12 ; H01L23/29 ; H01L23/36 ; H01L25/04 ; H01L25/18 ; H05K1/02 ; H05K1/18 ; H05K3/30 ; H01L23/02 ; H01L23/10
摘要：
A heat radiation electrode (15) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to this heat radiation electrode (15). The back surface of this metal plate (23) and the back surface of a flexible sheet become substantially within a same plane, so that it is readily affixed to a second supporting member (24). In addition, the top surface of the heat radiation electrode (15) is made protrusive beyond the top surfaces of the pads (14) to reduce the distance between the semiconductor chip (16) and the heat radiation electrode (15). Accordingly, the heat generated by the semiconductor chip can be efficiently dissipated via the heat radiation electrode (15), the metal plate (23) and the second supporting member (24).
公开/授权文献
- US20040256711A1 Semiconductor device, semiconductor module and hard disk 公开/授权日：2004-12-23
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