发明授权
- 专利标题： Semiconductor integrated circuit device
- 专利标题（中）： 半导体集成电路器件
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申请号： US10416717申请日： 2001-10-19
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公开(公告)号： US06898110B2公开(公告)日： 2005-05-24
- 发明人: Manabu Ishimatsu , Yoshihiko Inoue , Hiroshi Yoshioka , Masahito Suzuki
- 申请人： Manabu Ishimatsu , Yoshihiko Inoue , Hiroshi Yoshioka , Masahito Suzuki
- 申请人地址： JP Tokyo JP Tokyo
- 专利权人： Hitachi, Ltd.,Hitachi ULSI Systems Co. Ltd.
- 当前专利权人： Hitachi, Ltd.,Hitachi ULSI Systems Co. Ltd.
- 当前专利权人地址： JP Tokyo JP Tokyo
- 代理机构： Reed Smith LLP
- 代理商 Stanley P. Fisher, Esq.; Juan Carlos A. Marquez, Esq.
- 优先权： JP2001-022754 20010131
- 国际申请： PCTJP01/09203 WO 20011019
- 国际公布： WO0206183 WO 20020808
- 主分类号： G11C29/00
- IPC分类号： G11C29/00 ; H01L23/528 ; G11C5/06
摘要：
In a device including regular circuits and redundant circuits, a plurality of relievable first wiring lines and a plurality of irrelievable second wiring lines are arranged in the same wiring layer as what constitutes the regular circuits and in the same direction, and at the same time the irrelievable wiring lines are arranged adjoining one another.
公开/授权文献
- US20040026716A1 Semiconductor integrated circuit device 公开/授权日：2004-02-12