发明授权
- 专利标题: Single workpiece processing system
- 专利标题(中): 单工件加工系统
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申请号: US10691688申请日: 2003-10-22
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公开(公告)号: US06900132B2公开(公告)日: 2005-05-31
- 发明人: Raymon F. Thompson , Jeffry A. Davis , Randy Harris , Dana R. Scranton , Ryan Pfeifle , Steven A. Peace , Brian Aegerter
- 申请人: Raymon F. Thompson , Jeffry A. Davis , Randy Harris , Dana R. Scranton , Ryan Pfeifle , Steven A. Peace , Brian Aegerter
- 申请人地址: US MT Kalispell
- 专利权人: Semitool, Inc.
- 当前专利权人: Semitool, Inc.
- 当前专利权人地址: US MT Kalispell
- 代理机构: Perkins Coie LLP
- 主分类号: H01L21/00
- IPC分类号: H01L21/00 ; H01L21/3213 ; H01L21/311
摘要:
A system for processing semiconductor wafers has process units on a deck of a frame. The process units and the deck have precision locating features, such as tapered pins, for precisely positioning the process units on the deck. Process units can be removed and replacement process units installed on the deck, without the need for recalibrating the load/unload robot. This reduces the time needed to replace process units and restart processing operations. Liquid chemical consumption during processing is reduced by drawing unused liquid out of supply lines and pumping it back to storage.
公开/授权文献
- US20040112738A1 Single workpiece processing system 公开/授权日:2004-06-17
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