发明授权
US06900284B2 POLY-O-HYDROXYAMIDES, POLYBENZOXAZOLES, PROCESSES FOR PRODUCING POLY-O-HYDROXYAMIDES, PROCESSES FOR PRODUCING POLYBENZOXAZOLES, DIELECTRICS INCLUDING A POLYBENZOXAZOLE, ELECTRONIC COMPONENTS INCLUDING THE DIELECTRICS, AND PROCESSES FOR MANUFACTURING THE ELECTRONIC COMPONENTS
失效
聚-O-羟基酰胺，聚苯并恶唑，聚-O-羟基胺的制备方法，制备聚苯并噻唑的方法，包括聚苯并噻唑的电介质，包括电介质的电子组分，以及制造电子组件的方法
- 专利标题： POLY-O-HYDROXYAMIDES, POLYBENZOXAZOLES, PROCESSES FOR PRODUCING POLY-O-HYDROXYAMIDES, PROCESSES FOR PRODUCING POLYBENZOXAZOLES, DIELECTRICS INCLUDING A POLYBENZOXAZOLE, ELECTRONIC COMPONENTS INCLUDING THE DIELECTRICS, AND PROCESSES FOR MANUFACTURING THE ELECTRONIC COMPONENTS
- 专利标题（中）： 聚-O-羟基酰胺，聚苯并恶唑，聚-O-羟基胺的制备方法，制备聚苯并噻唑的方法，包括聚苯并噻唑的电介质，包括电介质的电子组分，以及制造电子组件的方法
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申请号： US10261034申请日： 2002-09-30
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公开(公告)号： US06900284B2公开(公告)日： 2005-05-31
- 发明人: Klaus Lowack , Anna Maltenberger , Recai Sezi , Andreas Walter
- 申请人： Klaus Lowack , Anna Maltenberger , Recai Sezi , Andreas Walter
- 申请人地址： DE Munich
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Munich
- 代理商 Laurence A. Greenberg; Werner H. Stemer; Gregory L. Mayback
- 优先权： DE10147927 20010928
- 主分类号： C08G73/00
- IPC分类号： C08G73/00 ; C08G73/10 ; C09D5/25 ; H01B3/30 ; H01L21/312 ; H01L23/532 ; C08G73/22 ; C08G69/00
摘要：
Poly-o-hydroxyamides are cyclicized to obtain polybenzoxazoles. The poly-o-hydroxyamides provide effective filling of trenches. In particular, the poly-o-hydroxyamides can fill trenches having a width of less than 100 nm and an aspect ratio of more than 4. Further, the polybenzoxazoles of the invention are very suitable for the damascene process. A dielectric can be made from the polybenzoxazole. In turn, semiconductor devices can include the dieletric. Processes for making the poly-o-hydroxyamides, polybenzoxazoles, and semiconductor devices are included.
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