发明授权
- 专利标题: Semiconductor device and method for manufacturing the same
- 专利标题(中): 半导体装置及其制造方法
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申请号: US10162503申请日: 2002-06-04
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公开(公告)号: US06900483B2公开(公告)日: 2005-05-31
- 发明人: Masao Uchida , Makoto Kitabatake , Toshiya Yokogawa , Osamu Kusumoto , Kunimasa Takahashi , Ryoko Miyanaga , Kenya Yamashita
- 申请人: Masao Uchida , Makoto Kitabatake , Toshiya Yokogawa , Osamu Kusumoto , Kunimasa Takahashi , Ryoko Miyanaga , Kenya Yamashita
- 申请人地址: JP Osaka
- 专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址: JP Osaka
- 代理机构: Harness, Dickey & Pierce, P.L.C.
- 优先权: JP2001-167970 20010604
- 主分类号: H01L21/329
- IPC分类号: H01L21/329 ; H01L29/24 ; H01L29/872 ; H01L29/80
摘要:
A Schottky diode includes a semiconductor substrate made of 4H—SiC, an epitaxially grown 4H—SiC layer, an ion implantation layer, a Schottky electrode, an ohmic electrode, and an insulative layer made of a thermal oxide film. The Schottky electrode and the insulative layer are not in contact with each other, with a gap being provided therebetween, whereby an altered layer does not occur. Therefore, it is possible to suppress the occurrence of a leak current.
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