发明授权
US06902689B2 Epoxy, epoxy system, and method of forming a conductive adhesive connection
失效
环氧树脂，环氧体系，以及形成导电性粘接剂的方法
- 专利标题： Epoxy, epoxy system, and method of forming a conductive adhesive connection
- 专利标题（中）： 环氧树脂，环氧体系，以及形成导电性粘接剂的方法
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申请号： US09844824申请日： 2001-04-26
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公开(公告)号： US06902689B2公开(公告)日： 2005-06-07
- 发明人: Rickie C. Lake , Krishna Kumar
- 申请人： Rickie C. Lake , Krishna Kumar
- 申请人地址： US ID Boise
- 专利权人： Micron Technology, Inc.
- 当前专利权人： Micron Technology, Inc.
- 当前专利权人地址： US ID Boise
- 代理机构： Wells St. John P.S.
- 主分类号： C08L63/00
- IPC分类号： C08L63/00 ; C09J5/06 ; C09J163/00 ; H01B1/20 ; H01B1/06
摘要：
The invention encompasses epoxies, epoxy systems, and methods of forming conductive adhesive connections between electrical nodes. An epoxy contains: a) a liquid mixture of a hardener and a base epoxy; and b) a concentration of an ionic salt within the liquid mixture, the concentration of the ionic salt being high enough that a 15 mil length sample of the liquid mixture having cross-sectional dimensions of 50 mil by 2 mil would have a resistance of less than about 100 ohms along its length.
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