发明授权
- 专利标题: Semiconductor laser device and method of fabricating the same
- 专利标题(中): 半导体激光器件及其制造方法
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申请号: US09532791申请日: 2000-03-22
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公开(公告)号: US06904071B1公开(公告)日: 2005-06-07
- 发明人: Takenori Goto , Nobuhiko Hayashi
- 申请人: Takenori Goto , Nobuhiko Hayashi
- 申请人地址: JP Osaka
- 专利权人: Sanyo Electric Co., Ltd.
- 当前专利权人: Sanyo Electric Co., Ltd.
- 当前专利权人地址: JP Osaka
- 代理机构: Westerman Hattori Daniels & Adrian, LLP
- 优先权: JP11-079470 19990324; JP2000-063271 20000308
- 主分类号: H01L33/06
- IPC分类号: H01L33/06 ; H01L33/14 ; H01L33/32 ; H01S5/065 ; H01S5/22 ; H01S5/223 ; H01S5/323 ; H01S5/343 ; H01S5/00
摘要:
An n-contact layer, an n-cladding layer, an MQW active layer, and a p-first cladding layer are formed in this order on a sapphire substrate. An n-current blocking layer having a striped opening is formed on the p-first cladding layer. The width of the striped opening gradually increases from W2 to W1 as the depth thereof decreases from a lower layer to an upper layer in the current blocking layer. A p-second cladding layer is formed on the n-current blocking layer and on the p-first cladding layer inside the striped opening. The p-second cladding layer comprises a lower layer having the width W2 at its lower end and an upper layer having a width W1 lager than the width W2.
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