发明授权
US06908960B2 COMPOSITE DIELECTRIC MATERIAL, COMPOSITE DIELECTRIC SUBSTRATE, PREPREG, COATED METAL FOIL, MOLDED SHEET, COMPOSITE MAGNETIC SUBSTRATE, SUBSTRATE, DOUBLE SIDE METAL FOIL-CLAD SUBSTRATE, FLAME RETARDANT SUBSTRATE, POLYVINYLBENZYL ETHER RESIN COMPOSITION, THERMOSETTIN
失效
复合介电材料，复合电介质基板，预制件，涂覆金属箔，成型片，复合磁性基板，基板，双面金属箔基板，阻燃基板，聚乙烯苯醚树脂组合物，热稳定剂
- 专利标题： COMPOSITE DIELECTRIC MATERIAL, COMPOSITE DIELECTRIC SUBSTRATE, PREPREG, COATED METAL FOIL, MOLDED SHEET, COMPOSITE MAGNETIC SUBSTRATE, SUBSTRATE, DOUBLE SIDE METAL FOIL-CLAD SUBSTRATE, FLAME RETARDANT SUBSTRATE, POLYVINYLBENZYL ETHER RESIN COMPOSITION, THERMOSETTIN
- 专利标题（中）： 复合介电材料，复合电介质基板，预制件，涂覆金属箔，成型片，复合磁性基板，基板，双面金属箔基板，阻燃基板，聚乙烯苯醚树脂组合物，热稳定剂
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申请号： US09748261申请日： 2000-12-27
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公开(公告)号： US06908960B2公开(公告)日： 2005-06-21
- 发明人: Minoru Takaya , Hisashi Kobuke , Toshikazu Endo , Seiji Takahara , Toshiyuki Abe , Hiroshige Ohkawa , Masami Sasaki , Kenichi Kawabata
- 申请人： Minoru Takaya , Hisashi Kobuke , Toshikazu Endo , Seiji Takahara , Toshiyuki Abe , Hiroshige Ohkawa , Masami Sasaki , Kenichi Kawabata
- 申请人地址： JP Tokyo
- 专利权人： TDK Corporation
- 当前专利权人： TDK Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- 优先权： JP11-373353 19991228; JP11-373804 19991228; JP11-373805 19991228; JP11-373806 19991228; JP11-375732 19991228; JP11-375753 19991228; JP2000-68364 20000313; JP2000-68366 20000313; JP2000-121629 20000421; JP2000-147591 20000519
- 主分类号： H01B3/44
- IPC分类号： H01B3/44 ; H01P1/203 ; H01P1/205 ; H01P5/10 ; H01P5/18 ; H01P7/04 ; H01P7/08 ; H01Q1/38 ; H05K1/02 ; H05K1/03 ; H05K1/16 ; H05K9/00 ; C08K3/40
摘要：
A composite dielectric material comprising a resin resulting from a polyvinylbenzyl ether compound and a dielectric ceramic powder dispersed therein is useful in the high-frequency region. A composite magnetic material comprising a polyvinylbenzyl ether compound and a magnetic powder is also provided as well as a flame retardant material comprising a polyvinylbenzyl ether compound and a flame retardant. These materials may be used in the fabrication of substrates, prepreg sheets, coated metal foils, molded items, and metal foil-clad substrates.
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