公开(公告)号：US20050130447A1

公开(公告)日：2005-06-16

申请号：US11045286

申请日：2005-01-31

申请人： Minoru Takaya ,  Hisashi Kobuke ,  Toshikazu Endo ,  Seiji Takahara ,  Toshiyuki Abe ,  Hiroshige Ohkawa ,  Masami Sasaki ,  Kenichi Kawabata

发明人： Minoru Takaya ,  Hisashi Kobuke ,  Toshikazu Endo ,  Seiji Takahara ,  Toshiyuki Abe ,  Hiroshige Ohkawa ,  Masami Sasaki ,  Kenichi Kawabata

IPC分类号： H01B3/44 ,  H01P1/203 ,  H01P1/205 ,  H01P5/10 ,  H01P5/18 ,  H01P7/04 ,  H01P7/08 ,  H01Q1/38 ,  H05K1/02 ,  H05K1/03 ,  H05K1/16 ,  H05K9/00 ,  H01L21/20 ,  C08J3/00 ,  C08K3/34 ,  C08L1/00 ,  H01L21/31 ,  H01L21/469

CPC分类号： H01P5/185 ,  H01B3/442 ,  H01P1/203 ,  H01P1/20345 ,  H01P1/2056 ,  H01P5/10 ,  H01P5/187 ,  H01P7/04 ,  H01P7/082 ,  H01P7/084 ,  H01Q1/38 ,  H05K1/024 ,  H05K1/0326 ,  H05K1/0373 ,  H05K1/162 ,  H05K1/165 ,  H05K9/0075 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/086 ,  Y10T428/31692 ,  Y10T428/31855

摘要： A composite dielectric material comprising a resin resulting from a polyvinylbenzyl ether compound and a dielectric ceramic powder dispersed therein is useful in the high-frequency region. A composite magnetic material comprising a polyvinylbenzyl ether compound and a magnetic powder is also provided as well as a flame retardant material comprising a polyvinylbenzyl ether compound and a flame retardant. These materials may be used in the fabrication of substrates, prepreg sheets, coated metal foils, molded items, and metal foil-clad substrates.

摘要翻译： 包含由聚乙烯基苄基醚化合物和分散在其中的介电陶瓷粉末产生的树脂的复合电介质材料可用于高频区域。 还提供了包含聚乙烯基苄基醚化合物和磁性粉末的复合磁性材料以及包含聚乙烯基苄基醚化合物和阻燃剂的阻燃材料。 这些材料可用于制造基材，预浸薄片，涂覆金属箔，模塑制品和覆盖金属箔的基板。

公开(公告)号：US20050130446A1

公开(公告)日：2005-06-16

申请号：US11045159

申请日：2005-01-31

申请人： Minoru Takaya ,  Hisashi Kobuke ,  Toshikazu Endo ,  Seiji Takahara ,  Toshiyuki Abe ,  Hiroshige Ohkawa ,  Masami Sasaki ,  Kenichi Kawabata

发明人： Minoru Takaya ,  Hisashi Kobuke ,  Toshikazu Endo ,  Seiji Takahara ,  Toshiyuki Abe ,  Hiroshige Ohkawa ,  Masami Sasaki ,  Kenichi Kawabata

IPC分类号： H01B3/44 ,  H01P1/203 ,  H01P1/205 ,  H01P5/10 ,  H01P5/18 ,  H01P7/04 ,  H01P7/08 ,  H01Q1/38 ,  H05K1/02 ,  H05K1/03 ,  H05K1/16 ,  H05K9/00 ,  H01L21/20 ,  C08J3/00 ,  C08K3/34 ,  C08L1/00 ,  H01L21/31 ,  H01L21/469

CPC分类号： H01P5/185 ,  H01B3/442 ,  H01P1/203 ,  H01P1/20345 ,  H01P1/2056 ,  H01P5/10 ,  H01P5/187 ,  H01P7/04 ,  H01P7/082 ,  H01P7/084 ,  H01Q1/38 ,  H05K1/024 ,  H05K1/0326 ,  H05K1/0373 ,  H05K1/162 ,  H05K1/165 ,  H05K9/0075 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/086 ,  Y10T428/31692 ,  Y10T428/31855

摘要： A composite dielectric material comprising a resin resulting from a polyvinylbenzyl ether compound and a dielectric ceramic powder dispersed therein is useful in the high-frequency region. A composite magnetic material comprising a polyvinylbenzyl ether compound and a magnetic powder is also provided as well as a flame retardant material comprising a polyvinylbenzyl ether compound and a flame retardant. These materials may be used in the fabrication of substrates, prepreg sheets, coated metal foils, molded items, and metal foil-clad substrates.

摘要翻译： 包含由聚乙烯基苄基醚化合物和分散在其中的介电陶瓷粉末产生的树脂的复合电介质材料可用于高频区域。 还提供了包含聚乙烯基苄基醚化合物和磁性粉末的复合磁性材料以及包含聚乙烯基苄基醚化合物和阻燃剂的阻燃材料。 这些材料可用于制造基材，预浸薄片，涂覆金属箔，模塑制品和覆盖金属箔的基板。

公开(公告)号：US20050154110A1

公开(公告)日：2005-07-14

申请号：US11045160

申请日：2005-01-31

申请人： Minoru Takaya ,  Hisashi Kobuke ,  Toshikazu Endo ,  Seiji Takahara ,  Toshiyuki Abe ,  Hiroshige Ohkawa ,  Masami Sasaki ,  Kenichi Kawabata

发明人： Minoru Takaya ,  Hisashi Kobuke ,  Toshikazu Endo ,  Seiji Takahara ,  Toshiyuki Abe ,  Hiroshige Ohkawa ,  Masami Sasaki ,  Kenichi Kawabata

IPC分类号： H01B3/44 ,  H01P1/203 ,  H01P1/205 ,  H01P5/10 ,  H01P5/18 ,  H01P7/04 ,  H01P7/08 ,  H01Q1/38 ,  H05K1/02 ,  H05K1/03 ,  H05K1/16 ,  H05K9/00 ,  C08K3/10

CPC分类号： H01P5/185 ,  H01B3/442 ,  H01P1/203 ,  H01P1/20345 ,  H01P1/2056 ,  H01P5/10 ,  H01P5/187 ,  H01P7/04 ,  H01P7/082 ,  H01P7/084 ,  H01Q1/38 ,  H05K1/024 ,  H05K1/0326 ,  H05K1/0373 ,  H05K1/162 ,  H05K1/165 ,  H05K9/0075 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/086 ,  Y10T428/31692 ,  Y10T428/31855

摘要： A composite dielectric material comprising a resin resulting from a polyvinylbenzyl ether compound and a dielectric, ceramic powder dispersed therein is useful in the high-frequency region. A composite magnetic material comprising a polyvinylbenzyl ether compound and a magnetic powder is also provided as well as a flame retardant material comprising a polyvinylbenzyl ether compound and a flame retardant. These materials may be used in the fabrication of substrates, prepreg sheets, coated metal foils, molded items, and metal foil-clad substrates.

摘要翻译： 包含由聚乙烯基苄基醚化合物产生的树脂和分散在其中的电介质陶瓷粉末的复合电介质材料可用于高频区域。 还提供了包含聚乙烯基苄基醚化合物和磁性粉末的复合磁性材料以及包含聚乙烯基苄基醚化合物和阻燃剂的阻燃材料。 这些材料可用于制造基材，预浸薄片，涂覆金属箔，模塑制品和覆盖金属箔的基板。

公开(公告)号：US06908960B2

公开(公告)日：2005-06-21

申请号：US09748261

申请日：2000-12-27

申请人： Minoru Takaya ,  Hisashi Kobuke ,  Toshikazu Endo ,  Seiji Takahara ,  Toshiyuki Abe ,  Hiroshige Ohkawa ,  Masami Sasaki ,  Kenichi Kawabata

发明人： Minoru Takaya ,  Hisashi Kobuke ,  Toshikazu Endo ,  Seiji Takahara ,  Toshiyuki Abe ,  Hiroshige Ohkawa ,  Masami Sasaki ,  Kenichi Kawabata

IPC分类号： H01B3/44 ,  H01P1/203 ,  H01P1/205 ,  H01P5/10 ,  H01P5/18 ,  H01P7/04 ,  H01P7/08 ,  H01Q1/38 ,  H05K1/02 ,  H05K1/03 ,  H05K1/16 ,  H05K9/00 ,  C08K3/40

CPC分类号： H01P5/185 ,  H01B3/442 ,  H01P1/203 ,  H01P1/20345 ,  H01P1/2056 ,  H01P5/10 ,  H01P5/187 ,  H01P7/04 ,  H01P7/082 ,  H01P7/084 ,  H01Q1/38 ,  H05K1/024 ,  H05K1/0326 ,  H05K1/0373 ,  H05K1/162 ,  H05K1/165 ,  H05K9/0075 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/086 ,  Y10T428/31692 ,  Y10T428/31855

摘要： A composite dielectric material comprising a resin resulting from a polyvinylbenzyl ether compound and a dielectric ceramic powder dispersed therein is useful in the high-frequency region. A composite magnetic material comprising a polyvinylbenzyl ether compound and a magnetic powder is also provided as well as a flame retardant material comprising a polyvinylbenzyl ether compound and a flame retardant. These materials may be used in the fabrication of substrates, prepreg sheets, coated metal foils, molded items, and metal foil-clad substrates.

摘要翻译： 包含由聚乙烯基苄基醚化合物和分散在其中的介电陶瓷粉末产生的树脂的复合电介质材料可用于高频区域。 还提供了包含聚乙烯基苄基醚化合物和磁性粉末的复合磁性材料以及包含聚乙烯基苄基醚化合物和阻燃剂的阻燃材料。 这些材料可用于制造基材，预浸薄片，涂覆金属箔，模塑制品和覆盖金属箔的基板。

公开(公告)号：US20050003199A1

公开(公告)日：2005-01-06

申请号：US10745587

申请日：2003-12-29

申请人： Minoru Takaya ,  Toshikazu Endo ,  Kenichi Kawabata

发明人： Minoru Takaya ,  Toshikazu Endo ,  Kenichi Kawabata

IPC分类号： B32B15/08 ,  C08G59/42 ,  C08J5/24 ,  C08L63/00 ,  C08L67/03 ,  H01F17/00 ,  H01F27/32 ,  H01L23/498 ,  H01L25/16 ,  H05K1/00 ,  H05K1/03 ,  H05K1/16 ,  H05K3/46 ,  B32B27/38 ,  B32B27/04

CPC分类号： B32B15/08 ,  B32B9/005 ,  B32B27/08 ,  B32B2305/076 ,  B32B2305/08 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/206 ,  C08G59/4223 ,  C08J5/10 ,  C08J5/18 ,  C08J5/24 ,  C08J2363/00 ,  C08L63/00 ,  C08L67/03 ,  H01F17/0006 ,  H01F27/323 ,  H01F27/327 ,  H01F2017/048 ,  H01L23/49894 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0373 ,  H05K1/162 ,  H05K3/4626 ,  H05K3/4676 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/09672 ,  Y10T428/2971 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529 ,  C08L2666/18 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention provides electronic parts which comprise a composite dielectric layer composed of an organic insulating material and a dielectric ceramic powder having a larger relative dielectric constant than the organic insulating material, and which also comprise conductive element sections forming inductor elements, etc., wherein the organic insulating material comprises a cured resin obtained by curing reaction of an epoxy resin with an active ester compound obtained by reaction between a compound with two or more carboxyl groups and a compound with a phenolic hydroxyl group. The dielectric ceramic powders of the described electronic parts have larger relative dielectric constants than the organic insulating materials, and the organic insulating materials have low dielectric loss tangents. It is possible to adequately reduce time-dependent dielectric constant changes in the high-frequency range of 100 MHz and above even with prolonged use at high temperatures of 100° C. and higher, while it is also possible to satisfactorily prevent deformation and other damage to the electronic parts during their handling.

摘要翻译： 本发明提供的电子部件包括由有机绝缘材料构成的复合电介质层和具有比有机绝缘材料更大的相对介电常数的介电陶瓷粉末，并且还包括形成电感元件的导电元件等，其中， 有机绝缘材料包括通过使环氧树脂与通过具有两个或更多个羧基的化合物和具有酚羟基的化合物之间的反应获得的活性酯化合物的反应固化而获得的固化树脂。 所述电子部件的介电陶瓷粉末具有比有机绝缘材料更大的相对介电常数，有机绝缘材料具有低的介电损耗角正切。 即使长时间在100℃以上的高温下使用也可以充分降低100MHz以上的高频范围的时间依赖介电常数的变化，同时也可以令人满意地防止变形等损伤 在处理电子零件时。

公开(公告)号：US20080044660A1

公开(公告)日：2008-02-21

申请号：US11892366

申请日：2007-08-22

申请人： Minoru Takaya ,  Toshikazu Endo ,  Kenichi Kawabata

发明人： Minoru Takaya ,  Toshikazu Endo ,  Kenichi Kawabata

IPC分类号： B32B27/38

CPC分类号： B32B15/08 ,  B32B9/005 ,  B32B27/08 ,  B32B2305/076 ,  B32B2305/08 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/206 ,  C08G59/4223 ,  C08J5/10 ,  C08J5/18 ,  C08J5/24 ,  C08J2363/00 ,  C08L63/00 ,  C08L67/03 ,  H01F17/0006 ,  H01F27/323 ,  H01F27/327 ,  H01F2017/048 ,  H01L23/49894 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0373 ,  H05K1/162 ,  H05K3/4626 ,  H05K3/4676 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/09672 ,  Y10T428/2971 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529 ,  C08L2666/18 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention provides electronic parts which comprise a composite dielectric layer composed of an organic insulating material and a dielectric ceramic powder having a larger relative dielectric constant than the organic insulating material, and which also comprise conductive element sections forming inductor elements, etc., wherein the organic insulating material comprises a cured resin obtained by curing reaction of an epoxy resin with an active ester compound obtained by reaction between a compound with two or more carboxyl groups and a compound with a phenolic hydroxyl group. The dielectric ceramic powders of the described electronic parts have larger relative dielectric constants than the organic insulating materials, and the organic insulating materials have low dielectric loss tangents. It is possible to adequately reduce time-dependent dielectric constant changes in the high-frequency range of 100 MHz and above even with prolonged use at high temperatures of 100° C. and higher, while it is also possible to satisfactorily prevent deformation and other damage to the electronic parts during their handling.

摘要翻译： 本发明提供的电子部件包括由有机绝缘材料构成的复合电介质层和具有比有机绝缘材料更大的相对介电常数的介电陶瓷粉末，并且还包括形成电感元件的导电元件等，其中， 有机绝缘材料包括通过使环氧树脂与通过具有两个或更多个羧基的化合物和具有酚羟基的化合物之间的反应获得的活性酯化合物的反应固化而获得的固化树脂。 所述电子部件的介电陶瓷粉末具有比有机绝缘材料更大的相对介电常数，有机绝缘材料具有低的介电损耗角正切。 即使长时间在100℃以上的高温下使用也可以充分降低100MHz以上的高频范围的时间依赖介电常数的变化，同时也可以令人满意地防止变形等损伤 在处理电子零件时。

公开(公告)号：US07547975B2

公开(公告)日：2009-06-16

申请号：US10900458

申请日：2004-07-28

申请人： Minoru Takaya ,  Hisayuki Abe ,  Kei Suzuki ,  Kosuke Takano ,  Kenichi Kawabata ,  Toshikazu Endo

发明人： Minoru Takaya ,  Hisayuki Abe ,  Kei Suzuki ,  Kosuke Takano ,  Kenichi Kawabata ,  Toshikazu Endo

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/82 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/19 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2224/04105 ,  H01L2224/05026 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16237 ,  H01L2224/82039 ,  H01L2224/82138 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K1/185 ,  H01L2924/00 ,  H01L2224/05599

摘要： A module with embedded semiconductor IC of the present invention includes a first resin layer, a second resin layer, post electrodes passing through the first and second resin layers, and a semiconductor IC mounted as embedded between the first resin layer and the second resin layer. Stud bumps are formed on land electrodes of the semiconductor IC and positioned with respect to the post electrodes. Owing to this positioning of the stud bumps formed on the semiconductor IC with respect to the post electrodes, the planar position of the stud bumps is substantially fixed. As a result, it is possible to use a semiconductor IC having a very narrow electrode pitch of 100 μm or smaller, particularly of around 60 μm.

摘要翻译： 具有本发明的嵌入式半导体IC的模块包括：第一树脂层，第二树脂层，通过第一和第二树脂层的柱电极;以及安装在第一树脂层和第二树脂层之间的半导体IC。 在半导体IC的接地电极上形成有柱状突起，并相对于柱状电极配置。 由于在半导体IC上相对于柱状电极形成的柱状凸块的这种定位，螺柱凸块的平面位置基本上是固定的。 结果，可以使用非常窄的电极间距为100μm或更小，特别是约60μm的半导体IC。

公开(公告)号：US20050029642A1

公开(公告)日：2005-02-10

申请号：US10900458

申请日：2004-07-28

申请人： Minoru Takaya ,  Hisayuki Abe ,  Kei Suzuki ,  Kosuke Takano ,  Kenichi Kawabata ,  Toshikazu Endo

发明人： Minoru Takaya ,  Hisayuki Abe ,  Kei Suzuki ,  Kosuke Takano ,  Kenichi Kawabata ,  Toshikazu Endo

IPC分类号： H01L21/60 ,  H01L23/538 ,  H05K1/18 ,  H01L23/02

CPC分类号： H01L24/82 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/19 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2224/04105 ,  H01L2224/05026 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16237 ,  H01L2224/82039 ,  H01L2224/82138 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K1/185 ,  H01L2924/00 ,  H01L2224/05599

摘要： A module with embedded semiconductor IC of the present invention includes a first resin layer, a second resin layer, post electrodes passing through the first and second resin layers, and a semiconductor IC mounted as embedded between the first resin layer and the second resin layer. Stud bumps are formed on land electrodes of the semiconductor IC and positioned with respect to the post electrodes. Owing to this positioning of the stud bumps formed on the semiconductor IC with respect to the post electrodes, the planar position of the stud bumps is substantially fixed. As a result, it is possible to use a semiconductor IC having a very narrow electrode pitch of 100 μm or smaller, particularly of around 60 μm.

摘要翻译： 具有本发明的嵌入式半导体IC的模块包括：第一树脂层，第二树脂层，通过第一和第二树脂层的柱电极;以及安装在第一树脂层和第二树脂层之间的半导体IC。 在半导体IC的接地电极上形成有柱状突起，并相对于柱状电极配置。 由于在半导体IC上相对于柱状电极形成的柱状凸块的这种定位，螺柱凸块的平面位置基本上是固定的。 结果，可以使用非常窄的电极间距为100μm或更小，特别是约60μm的半导体IC。

公开(公告)号：US20090025961A1

公开(公告)日：2009-01-29

申请号：US12219354

申请日：2008-07-21

申请人： Yoshikazu Kanemaru ,  Hiroshige Ohkawa ,  Kenichi Kawabata

发明人： Yoshikazu Kanemaru ,  Hiroshige Ohkawa ,  Kenichi Kawabata

IPC分类号： H05K1/00 ,  H05K3/10

CPC分类号： H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3511 ,  H05K3/0052 ,  H05K3/4644 ,  H05K2201/10204 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611 ,  Y10T29/49155 ,  H01L2224/82 ,  H01L2924/00

摘要： A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet 100 includes insulating layers 21 and 31 on one surface of an approximately rectangular substrate 11, and electronic components 41 and chip-like dummy parts 51 primarily made from the same material as the primary material of the electronic component 41 are embedded into the insulating layer 21. Chip-like dummy parts 51 are disposed in an unmounted portion of the electronic components 41 in, for example, a frame-like arrangement so as to surround the plurality of electronic components (groups) 41.

摘要翻译： 提供一种电子部件嵌入式基板的制造方法，其能够抑制翘曲而不需要以低成本进行复杂的加工，并且提供高生产率和经济效率。 工作片100在大致矩形的基板11的一个表面上包括绝缘层21和31，并且主要由与电子部件41的主要材料相同的材料制成的电子部件41和芯片状的虚拟部分51嵌入绝缘层 芯片状虚拟部件51以例如框状的方式设置在电子部件41的未安装部分中，以围绕多个电子部件（组）41。

公开(公告)号：US20100051189A1

公开(公告)日：2010-03-04

申请号：US12461818

申请日：2009-08-25

申请人： Kenichi Kawabata ,  Hiroshige Ohkawa

发明人： Kenichi Kawabata ,  Hiroshige Ohkawa

IPC分类号： B32B38/10

CPC分类号： B32B43/006 ,  B32B37/12 ,  B32B2038/0084 ,  B32B2457/08 ,  H05K3/007 ,  H05K3/025 ,  H05K3/386 ,  H05K3/4602 ,  H05K3/4682 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0191 ,  H05K2203/0264 ,  H05K2203/1105 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T156/11 ,  Y10T156/1142

摘要： Provided is a method of manufacturing a wiring board, in which; a composite adhesive sheet 20 is attached to one of the surfaces of a support substrate 10, and a double-sided CCL 30 is attached to the other surface. Then, in an integrated state of the above components, a multilayer wiring structure including a conductive layer and a resin insulating layer is formed on a metal layer 33 of the double-sided CCL 30 by a known build-up method. A thermally foamable adhesive layer 22 of the composite adhesive sheet 20 is then heated, thereby thermally decomposing a thermal foaming agent to generate gas, and the support substrate 10 is separated from the remaining bonded body. Thereafter, a carrier foil layer 32b and a copper foil layer 32a of a carrier-foil coated copper foil 32 are mechanically peeled from each other at a boundary between both the layers, thereby obtaining a wiring board 1.

摘要翻译： 提供一种制造布线板的方法，其中： 将复合粘合片20安装在支撑基板10的一个表面上，并且双面CCL 30附接到另一表面。 然后，在上述部件的集成状态下，通过已知的堆积方法在双面CCL 30的金属层33上形成包括导电层和树脂绝缘层的多层布线结构。 然后将复合粘合片20的热发泡性粘合剂层22加热，由此热分解热发泡剂以产生气体，并且将支撑基板10与剩余的粘合体分离。 此后，在两层之间的边界处机械地剥离载体箔层32b和载体箔涂覆铜箔32的铜箔层32a，从而获得布线板1。