发明授权
US06909173B2 Flexible substrate, semiconductor device, imaging device, radiation imaging device and radiation imaging system
失效
柔性基板，半导体器件，成像器件，辐射成像器件和放射成像系统
- 专利标题： Flexible substrate, semiconductor device, imaging device, radiation imaging device and radiation imaging system
- 专利标题（中）： 柔性基板，半导体器件，成像器件，辐射成像器件和放射成像系统
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申请号： US10165319申请日： 2002-06-10
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公开(公告)号： US06909173B2公开(公告)日： 2005-06-21
- 发明人: Osamu Hamamoto , Koji Sato , Kenji Kajiwara
- 申请人： Osamu Hamamoto , Koji Sato , Kenji Kajiwara
- 申请人地址： JP Tokyo
- 专利权人： Canon Kabushiki Kaisha
- 当前专利权人： Canon Kabushiki Kaisha
- 当前专利权人地址： JP Tokyo
- 代理机构： Fitzpatrick, Cella, Harper & Scinto
- 优先权： JP2001/178844 20010613
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L25/04 ; H05K1/11 ; H05K3/40 ; H01L23/48 ; H01L23/52
摘要：
The invention concerns a flexible substrate comprising an inner lead connected to an external connection terminal formed on a substrate, and a base film formed on the lead. The base film area above the substrate and closest to the terminal is thinner than the terminal. The invention also provides a semiconductor device comprising an inner lead connected to an external connection terminal formed on a substrate, and a base film formed on the lead. The base film area above the substrate and closest to the terminal is thinner than the terminal. The invention also provides for a manufacturing method a semiconductor device comprising a substrate, an external connection terminal, and an inner lead with a base film. Further, the invention provides a semiconductor device with a substrate with a chamfered corner between the connection and side faces. By the invention, connection of an inner lead or a flexible substrate is made easier.
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