发明授权
- 专利标题： Electronic device cooling system and method of use
- 专利标题（中）： 电子设备冷却系统及其使用方法
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申请号： US10637138申请日： 2003-08-08
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公开(公告)号： US06909606B2公开(公告)日： 2005-06-21
- 发明人: Stephan K. Barsun , Thom Augustin
- 申请人： Stephan K. Barsun , Thom Augustin
- 申请人地址： US TX Houston
- 专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人地址： US TX Houston
- 主分类号： G06F1/20
- IPC分类号： G06F1/20 ; H05K7/20
摘要：
An electronic device cooling system includes a heat exchange unit; at least one cooling interface disposed at a heat-transfer interface of an electronic device, where the cooling interface is thermally coupled to the heat exchange unit; and a heat exhaust that is thermally coupled to the heat exchange unit. The heat exhaust exhausts heat from the heat exchange unit to a remote location from the electronic device.
公开/授权文献
- US20050030716A1 ELECTRONIC DEVICE COOLING SYSTEM AND METHOD OF USE 公开/授权日：2005-02-10
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