发明授权
- 专利标题： Surface mount multichip devices
- 专利标题（中）： 表面贴装多芯片器件
-
申请号： US10617343申请日： 2003-07-10
-
公开(公告)号： US06919625B2公开(公告)日： 2005-07-19
- 发明人: Paddy O'Shea , Eamonn Medley , Finbarr O'Donoghue , Gary Horsman
- 申请人： Paddy O'Shea , Eamonn Medley , Finbarr O'Donoghue , Gary Horsman
- 申请人地址： US NY Melville
- 专利权人： General Semiconductor, Inc.
- 当前专利权人： General Semiconductor, Inc.
- 当前专利权人地址： US NY Melville
- 代理机构： Mayer Fortkort & Williams PC
- 代理商 Stuart H. Mayer, Esq.; Karin L. Williams, Esq.
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/48
摘要：
A surface mountable multi-chip device is provided which includes first and second lead frames portions and at least two chips. The lead frame portions each include a header region and a lead region. Beneficially, the header regions of the first and second lead frame portions lie in a common plane, with at least one semiconductor chip being placed on each of the header regions. A conductive member link is placed on top of the two chips to electrically and mechanically interconnect the chips.
公开/授权文献
- US20050006731A1 Surface mount multichip devices 公开/授权日：2005-01-13
信息查询
IPC分类:
