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公开(公告)号：US07525183B2
公开(公告)日：2009-04-28
申请号：US11825991
申请日：2007-07-10
申请人： Paddy O'Shea , Eamonn Medley , Finbarr O'Donoghue , Gary Horsman
发明人： Paddy O'Shea , Eamonn Medley , Finbarr O'Donoghue , Gary Horsman
IPC分类号： H01L23/495
CPC分类号： H01L23/49575 , H01L23/49524 , H01L23/49551 , H01L23/49562 , H01L24/36 , H01L24/40 , H01L24/48 , H01L2224/4007 , H01L2224/40137 , H01L2224/48137 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/1301 , H01L2924/181 , H01L2924/3011 , Y10S257/916 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/37099
摘要： A surface mountable multi-chip device is provided which includes first and second lead frames portions and at least two chips. The lead frame portions each include a header region and a lead region. Beneficially, the header regions of the first and second lead frame portions lie in a common plane, with at least one semiconductor chip being placed on each of the header regions. A conductive member link is placed on top of the two chips to electrically and mechanically interconnect the chips.
摘要翻译： 提供了一种表面贴装多芯片器件，其包括第一引线框架部分和第二引线框架部分以及至少两个芯片。 引线框架部分各自包括头部区域和引线区域。 有利的是，第一引线框架部分和第二引线框架部分的头部区域位于公共平面中，其中至少一个半导体芯片被放置在每个头部区域上。 导电构件连接件放置在两个芯片的顶部上以电和机械地互连芯片。
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公开(公告)号：US06919625B2
公开(公告)日：2005-07-19
申请号：US10617343
申请日：2003-07-10
申请人： Paddy O'Shea , Eamonn Medley , Finbarr O'Donoghue , Gary Horsman
发明人： Paddy O'Shea , Eamonn Medley , Finbarr O'Donoghue , Gary Horsman
IPC分类号： H01L23/495 , H01L23/48
CPC分类号： H01L23/49575 , H01L23/49524 , H01L23/49551 , H01L23/49562 , H01L24/36 , H01L24/40 , H01L24/48 , H01L2224/4007 , H01L2224/40137 , H01L2224/48137 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/1301 , H01L2924/181 , H01L2924/3011 , Y10S257/916 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/37099
摘要： A surface mountable multi-chip device is provided which includes first and second lead frames portions and at least two chips. The lead frame portions each include a header region and a lead region. Beneficially, the header regions of the first and second lead frame portions lie in a common plane, with at least one semiconductor chip being placed on each of the header regions. A conductive member link is placed on top of the two chips to electrically and mechanically interconnect the chips.
摘要翻译： 提供了一种可表面安装的多芯片器件，其包括第一引线框架部分和第二引线框架部分以及至少两个芯片。 引线框架部分各自包括头部区域和引线区域。 有利的是，第一引线框架部分和第二引线框架部分的头部区域位于公共平面中，其中至少一个半导体芯片被放置在每个头部区域上。 导电构件连接件放置在两个芯片的顶部上以电和机械地互连芯片。
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公开(公告)号：US20080017959A1
公开(公告)日：2008-01-24
申请号：US11825991
申请日：2007-07-10
申请人： Paddy O'Shea , Eamonn Medley , Finbarr O'Donoghue , Gary Horsman
发明人： Paddy O'Shea , Eamonn Medley , Finbarr O'Donoghue , Gary Horsman
IPC分类号： H01L23/495
CPC分类号： H01L23/49575 , H01L23/49524 , H01L23/49551 , H01L23/49562 , H01L24/36 , H01L24/40 , H01L24/48 , H01L2224/4007 , H01L2224/40137 , H01L2224/48137 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/1301 , H01L2924/181 , H01L2924/3011 , Y10S257/916 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/37099
摘要： A surface mountable multi-chip device is provided which includes first and second lead frames portions and at least two chips. The lead frame portions each include a header region and a lead region. Beneficially, the header regions of the first and second lead frame portions lie in a common plane, with at least one semiconductor chip being placed on each of the header regions. A conductive member link is placed on top of the two chips to electrically and mechanically interconnect the chips.
摘要翻译： 提供了一种表面贴装多芯片器件，其包括第一引线框架部分和第二引线框架部分以及至少两个芯片。 引线框架部分各自包括头部区域和引线区域。 有利的是，第一引线框架部分和第二引线框架部分的头部区域位于公共平面中，其中至少一个半导体芯片被放置在每个头部区域上。 导电构件连接件放置在两个芯片的顶部上以电和机械地互连芯片。
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公开(公告)号：US07242078B2
公开(公告)日：2007-07-10
申请号：US11183504
申请日：2005-07-18
申请人： Paddy O'Shea , Eamonn Medley , Finbarr O'Donoghue , Gary Horsman
发明人： Paddy O'Shea , Eamonn Medley , Finbarr O'Donoghue , Gary Horsman
IPC分类号： H01L29/22 , H01L23/495 , H01L23/48
CPC分类号： H01L23/49575 , H01L23/49524 , H01L23/49551 , H01L23/49562 , H01L24/36 , H01L24/40 , H01L24/48 , H01L2224/4007 , H01L2224/40137 , H01L2224/48137 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/1301 , H01L2924/181 , H01L2924/3011 , Y10S257/916 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/37099
摘要： A surface mountable multi-chip device is provided which includes first and second lead frames portions and at least two chips. The lead frame portions each include a header region and a lead region. Beneficially, the header regions of the first and second lead frame portions lie in a common plane, with at least one semiconductor chip being placed on each of the header regions. A conductive member link is placed on top of the two chips to electrically and mechanically interconnect the chips.
摘要翻译： 提供了一种可表面安装的多芯片器件，其包括第一引线框架部分和第二引线框架部分以及至少两个芯片。 引线框架部分各自包括头部区域和引线区域。 有利的是，第一引线框架部分和第二引线框架部分的头部区域位于公共平面中，其中至少一个半导体芯片被放置在每个头部区域上。 导电构件连接件放置在两个芯片的顶部上以电和机械地互连芯片。
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公开(公告)号：US20050248007A1
公开(公告)日：2005-11-10
申请号：US11183504
申请日：2005-07-18
申请人： Paddy O'Shea , Eamonn Medley , Finbarr O'Donoghue , Gary Horsman
发明人： Paddy O'Shea , Eamonn Medley , Finbarr O'Donoghue , Gary Horsman
IPC分类号： H01L23/495 , H01L29/22
CPC分类号： H01L23/49575 , H01L23/49524 , H01L23/49551 , H01L23/49562 , H01L24/36 , H01L24/40 , H01L24/48 , H01L2224/4007 , H01L2224/40137 , H01L2224/48137 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/1301 , H01L2924/181 , H01L2924/3011 , Y10S257/916 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/37099
摘要： A surface mountable multi-chip device is provided which includes first and second lead frames portions and at least two chips. The lead frame portions each include a header region and a lead region. Beneficially, the header regions of the first and second lead frame portions lie in a common plane, with at least one semiconductor chip being placed on each of the header regions. A conductive member link is placed on top of the two chips to electrically and mechanically interconnect the chips.
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公开(公告)号：US20050006731A1
公开(公告)日：2005-01-13
申请号：US10617343
申请日：2003-07-10
申请人： Paddy O'Shea , Eamonn Medley , Finbarr O'Donoghue , Gary Horsman
发明人： Paddy O'Shea , Eamonn Medley , Finbarr O'Donoghue , Gary Horsman
IPC分类号： H01L23/495 , H01L21/48
CPC分类号： H01L23/49575 , H01L23/49524 , H01L23/49551 , H01L23/49562 , H01L24/36 , H01L24/40 , H01L24/48 , H01L2224/4007 , H01L2224/40137 , H01L2224/48137 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/1301 , H01L2924/181 , H01L2924/3011 , Y10S257/916 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/37099
摘要： A surface mountable multi-chip device is provided which includes first and second lead frames portions and at least two chips. The lead frame portions each include a header region and a lead region. Beneficially, the header regions of the first and second lead frame portions lie in a common plane, with at least one semiconductor chip being placed on each of the header regions. A conductive member link is placed on top of the two chips to electrically and mechanically interconnect the chips.
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