公开(公告)号：US07525183B2

公开(公告)日：2009-04-28

申请号：US11825991

申请日：2007-07-10

申请人： Paddy O'Shea ,  Eamonn Medley ,  Finbarr O'Donoghue ,  Gary Horsman

发明人： Paddy O'Shea ,  Eamonn Medley ,  Finbarr O'Donoghue ,  Gary Horsman

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L23/49524 ,  H01L23/49551 ,  H01L23/49562 ,  H01L24/36 ,  H01L24/40 ,  H01L24/48 ,  H01L2224/4007 ,  H01L2224/40137 ,  H01L2224/48137 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/1301 ,  H01L2924/181 ,  H01L2924/3011 ,  Y10S257/916 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/37099

摘要： A surface mountable multi-chip device is provided which includes first and second lead frames portions and at least two chips. The lead frame portions each include a header region and a lead region. Beneficially, the header regions of the first and second lead frame portions lie in a common plane, with at least one semiconductor chip being placed on each of the header regions. A conductive member link is placed on top of the two chips to electrically and mechanically interconnect the chips.

摘要翻译： 提供了一种表面贴装多芯片器件，其包括第一引线框架部分和第二引线框架部分以及至少两个芯片。 引线框架部分各自包括头部区域和引线区域。 有利的是，第一引线框架部分和第二引线框架部分的头部区域位于公共平面中，其中至少一个半导体芯片被放置在每个头部区域上。 导电构件连接件放置在两个芯片的顶部上以电和机械地互连芯片。

公开(公告)号：US06919625B2

公开(公告)日：2005-07-19

申请号：US10617343

申请日：2003-07-10

申请人： Paddy O'Shea ,  Eamonn Medley ,  Finbarr O'Donoghue ,  Gary Horsman

发明人： Paddy O'Shea ,  Eamonn Medley ,  Finbarr O'Donoghue ,  Gary Horsman

IPC分类号： H01L23/495 ,  H01L23/48

CPC分类号： H01L23/49575 ,  H01L23/49524 ,  H01L23/49551 ,  H01L23/49562 ,  H01L24/36 ,  H01L24/40 ,  H01L24/48 ,  H01L2224/4007 ,  H01L2224/40137 ,  H01L2224/48137 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/1301 ,  H01L2924/181 ,  H01L2924/3011 ,  Y10S257/916 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/37099

摘要： A surface mountable multi-chip device is provided which includes first and second lead frames portions and at least two chips. The lead frame portions each include a header region and a lead region. Beneficially, the header regions of the first and second lead frame portions lie in a common plane, with at least one semiconductor chip being placed on each of the header regions. A conductive member link is placed on top of the two chips to electrically and mechanically interconnect the chips.

摘要翻译： 提供了一种可表面安装的多芯片器件，其包括第一引线框架部分和第二引线框架部分以及至少两个芯片。 引线框架部分各自包括头部区域和引线区域。 有利的是，第一引线框架部分和第二引线框架部分的头部区域位于公共平面中，其中至少一个半导体芯片被放置在每个头部区域上。 导电构件连接件放置在两个芯片的顶部上以电和机械地互连芯片。

公开(公告)号：US20080017959A1

公开(公告)日：2008-01-24

申请号：US11825991

申请日：2007-07-10

申请人： Paddy O'Shea ,  Eamonn Medley ,  Finbarr O'Donoghue ,  Gary Horsman

发明人： Paddy O'Shea ,  Eamonn Medley ,  Finbarr O'Donoghue ,  Gary Horsman

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L23/49524 ,  H01L23/49551 ,  H01L23/49562 ,  H01L24/36 ,  H01L24/40 ,  H01L24/48 ,  H01L2224/4007 ,  H01L2224/40137 ,  H01L2224/48137 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/1301 ,  H01L2924/181 ,  H01L2924/3011 ,  Y10S257/916 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/37099

摘要： A surface mountable multi-chip device is provided which includes first and second lead frames portions and at least two chips. The lead frame portions each include a header region and a lead region. Beneficially, the header regions of the first and second lead frame portions lie in a common plane, with at least one semiconductor chip being placed on each of the header regions. A conductive member link is placed on top of the two chips to electrically and mechanically interconnect the chips.

摘要翻译： 提供了一种表面贴装多芯片器件，其包括第一引线框架部分和第二引线框架部分以及至少两个芯片。 引线框架部分各自包括头部区域和引线区域。 有利的是，第一引线框架部分和第二引线框架部分的头部区域位于公共平面中，其中至少一个半导体芯片被放置在每个头部区域上。 导电构件连接件放置在两个芯片的顶部上以电和机械地互连芯片。

公开(公告)号：US07242078B2

公开(公告)日：2007-07-10

申请号：US11183504

申请日：2005-07-18

申请人： Paddy O'Shea ,  Eamonn Medley ,  Finbarr O'Donoghue ,  Gary Horsman

发明人： Paddy O'Shea ,  Eamonn Medley ,  Finbarr O'Donoghue ,  Gary Horsman

IPC分类号： H01L29/22 ,  H01L23/495 ,  H01L23/48

CPC分类号： H01L23/49575 ,  H01L23/49524 ,  H01L23/49551 ,  H01L23/49562 ,  H01L24/36 ,  H01L24/40 ,  H01L24/48 ,  H01L2224/4007 ,  H01L2224/40137 ,  H01L2224/48137 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/1301 ,  H01L2924/181 ,  H01L2924/3011 ,  Y10S257/916 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/37099

摘要： A surface mountable multi-chip device is provided which includes first and second lead frames portions and at least two chips. The lead frame portions each include a header region and a lead region. Beneficially, the header regions of the first and second lead frame portions lie in a common plane, with at least one semiconductor chip being placed on each of the header regions. A conductive member link is placed on top of the two chips to electrically and mechanically interconnect the chips.

摘要翻译： 提供了一种可表面安装的多芯片器件，其包括第一引线框架部分和第二引线框架部分以及至少两个芯片。 引线框架部分各自包括头部区域和引线区域。 有利的是，第一引线框架部分和第二引线框架部分的头部区域位于公共平面中，其中至少一个半导体芯片被放置在每个头部区域上。 导电构件连接件放置在两个芯片的顶部上以电和机械地互连芯片。

公开(公告)号：US20050248007A1

公开(公告)日：2005-11-10

申请号：US11183504

申请日：2005-07-18

申请人： Paddy O'Shea ,  Eamonn Medley ,  Finbarr O'Donoghue ,  Gary Horsman

发明人： Paddy O'Shea ,  Eamonn Medley ,  Finbarr O'Donoghue ,  Gary Horsman

IPC分类号： H01L23/495 ,  H01L29/22

CPC分类号： H01L23/49575 ,  H01L23/49524 ,  H01L23/49551 ,  H01L23/49562 ,  H01L24/36 ,  H01L24/40 ,  H01L24/48 ,  H01L2224/4007 ,  H01L2224/40137 ,  H01L2224/48137 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/1301 ,  H01L2924/181 ,  H01L2924/3011 ,  Y10S257/916 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/37099

摘要： A surface mountable multi-chip device is provided which includes first and second lead frames portions and at least two chips. The lead frame portions each include a header region and a lead region. Beneficially, the header regions of the first and second lead frame portions lie in a common plane, with at least one semiconductor chip being placed on each of the header regions. A conductive member link is placed on top of the two chips to electrically and mechanically interconnect the chips.

公开(公告)号：US20050006731A1

公开(公告)日：2005-01-13

申请号：US10617343

申请日：2003-07-10

申请人： Paddy O'Shea ,  Eamonn Medley ,  Finbarr O'Donoghue ,  Gary Horsman

发明人： Paddy O'Shea ,  Eamonn Medley ,  Finbarr O'Donoghue ,  Gary Horsman

IPC分类号： H01L23/495 ,  H01L21/48

CPC分类号： H01L23/49575 ,  H01L23/49524 ,  H01L23/49551 ,  H01L23/49562 ,  H01L24/36 ,  H01L24/40 ,  H01L24/48 ,  H01L2224/4007 ,  H01L2224/40137 ,  H01L2224/48137 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/1301 ,  H01L2924/181 ,  H01L2924/3011 ,  Y10S257/916 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/37099

摘要： A surface mountable multi-chip device is provided which includes first and second lead frames portions and at least two chips. The lead frame portions each include a header region and a lead region. Beneficially, the header regions of the first and second lead frame portions lie in a common plane, with at least one semiconductor chip being placed on each of the header regions. A conductive member link is placed on top of the two chips to electrically and mechanically interconnect the chips.

公开(公告)号：US06281043B1

公开(公告)日：2001-08-28

申请号：US09382131

申请日：1999-08-24

申请人： Tadhgh O'Brien ,  Marie Guillot ,  Finbarr O'Donoghue ,  Owen McAuliffe

发明人： Tadhgh O'Brien ,  Marie Guillot ,  Finbarr O'Donoghue ,  Owen McAuliffe

IPC分类号： H01L2144

CPC分类号： H01L23/49575 ,  H01L23/49537 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/33 ,  H01L24/97 ,  H01L2224/27013 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/00

摘要： Two phase bridge rectifier, plastic encapsulated devices having four external terminal leads are batch fabricated using a workpiece of three stacked together lead frames wherein, at each of a plurality of device sites on the workpiece, two, two-chip stacks of semiconductor diode chips are provided; each chip of each stack being sandwiched between respective pairs of bonding pads on either top and middle lead frames or middle and bottom lead frames. Each of the two bonding pads of the middle frame is connected to a respective integral terminal lead of the middle frame. An integral extension of a bonding pad of each of the top and bottom lead frames is bent out of the plane of its respective lead frame to include a flat terminal lead portion lying in the plane of the middle frame but not connected thereto. All four in-plane terminal leads include dam bars for use during device encapsulating; the dam bars from the top and bottom lead frames cooperating to form a single, in-plane dam bar. After encapsulation, individual devices are separated from the lead frame workpiece by severing ends of the four terminal leads from their respective lead frames.

摘要翻译： 两相桥式整流器，具有四个外部端子引线的塑料封装装置使用三个堆叠在一起的引线框架的工件进行批量制造，其中在工件上的多个器件位置的每一个处，两个二芯片堆叠的半导体二极管芯片是 提供; 每个堆叠的每个芯片夹在顶部和中间引线框架或中间和底部引线框架之间的各对焊接焊盘之间。 中间框架的两个接合焊盘中的每一个连接到中间框架的相应的一体端子引线。 顶部引线框架和底部引线框架中的每一个的接合焊盘的整体延伸部从其相应的引线框架的平面弯曲成包括位于中间框架的平面中但不与其连接的平坦端子引线部分。 所有四个平面内终端引线包括在装置封装期间使用的坝条; 来自顶部和底部引线框架的坝条协作形成一个单一的面内坝。 在封装之后，通过从它们各自的引线框架切断四个端子引线的端部，将各个器件与引线框架工件分开。