- 专利标题： Solder paste printing apparatus and printing method
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申请号： US10031852申请日： 2000-07-25
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公开(公告)号： US06923117B1公开(公告)日： 2005-08-02
- 发明人: Hiroaki Onishi , Toshinori Mimura , Naoichi Chikahisa , Ken Takahashi , Toshiyuki Murakami , Hitoshi Nakahira , Sadayuki Nagashima
- 申请人： Hiroaki Onishi , Toshinori Mimura , Naoichi Chikahisa , Ken Takahashi , Toshiyuki Murakami , Hitoshi Nakahira , Sadayuki Nagashima
- 申请人地址： JP Osaka
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JP11-211330 19990726; JP11-252148 19990906; JP11-315384 19991105; JP11-347714 19991207; JP2000-220873 20000721
- 国际申请： PCT/JP00/04937 WO 20000725
- 国际公布： WO01/07255 WO 20010201
- 主分类号： B41F15/46
- IPC分类号： B41F15/46 ; H05K1/02 ; H05K3/00 ; H05K3/12 ; H05K3/26 ; B41F15/03 ; B41F15/42
摘要：
When solder paste passes through a first gap located between a pressurizing member and a printing mask during solder paste printing, a pressure directed toward the printing mask is applied from the pressurizing member to the solder paste.
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