公开(公告)号：US06923117B1

公开(公告)日：2005-08-02

申请号：US10031852

申请日：2000-07-25

申请人： Hiroaki Onishi ,  Toshinori Mimura ,  Naoichi Chikahisa ,  Ken Takahashi ,  Toshiyuki Murakami ,  Hitoshi Nakahira ,  Sadayuki Nagashima

发明人： Hiroaki Onishi ,  Toshinori Mimura ,  Naoichi Chikahisa ,  Ken Takahashi ,  Toshiyuki Murakami ,  Hitoshi Nakahira ,  Sadayuki Nagashima

IPC分类号： B41F15/46 ,  H05K1/02 ,  H05K3/00 ,  H05K3/12 ,  H05K3/26 ,  B41F15/03 ,  B41F15/42

CPC分类号： B41F15/46 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/1216 ,  H05K3/1233 ,  H05K3/26 ,  H05K2201/09918 ,  H05K2203/0139 ,  H05K2203/0278 ,  H05K2203/082 ,  H05K2203/163 ,  H05K2203/167

摘要： When solder paste passes through a first gap located between a pressurizing member and a printing mask during solder paste printing, a pressure directed toward the printing mask is applied from the pressurizing member to the solder paste.