Invention Grant
- Patent Title: Solder precipitating composition
- Patent Title (中): 焊锡沉淀组合物
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Application No.: US10342210Application Date: 2003-01-15
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Publication No.: US06923875B2Publication Date: 2005-08-02
- Inventor: Kazuki Ikeda , Hiroshi Tanaka , Hisao Irie , Keigo Obata , Takao Takeuchi , Naoya Inoue
- Applicant: Kazuki Ikeda , Hiroshi Tanaka , Hisao Irie , Keigo Obata , Takao Takeuchi , Naoya Inoue
- Applicant Address: JP Kakogawa
- Assignee: Harima Chemicals, Inc.
- Current Assignee: Harima Chemicals, Inc.
- Current Assignee Address: JP Kakogawa
- Agency: Sughrue Mion, PLLC
- Priority: JP2002-052849 20020228
- Main IPC: B23K35/34
- IPC: B23K35/34 ; B23K35/26 ; B23K35/363 ; C22C13/00 ; H05K3/34 ; C23C18/00
Abstract:
According to present invention, there is provided a lead-free solder precipitating composition comprising a tin powder, and a complex of silver ions and/or copper ions and aryl phosphines, alkyl phosphine, phosphines or azoles. The solder precipitating composition can form proper lead-free solder on lands of a circuit board, without forming silver and/or copper film on the circuit board.
Public/Granted literature
- US20030159761A1 Solder precipitating composition and solder precipitation method Public/Granted day:2003-08-28
Information query
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