发明授权
US06923923B2 Metallic nanoparticle cluster ink and method for forming metal pattern using the same
有权
金属纳米颗粒簇墨水和使用其形成金属图案的方法
- 专利标题： Metallic nanoparticle cluster ink and method for forming metal pattern using the same
- 专利标题（中）： 金属纳米颗粒簇墨水和使用其形成金属图案的方法
-
申请号： US10329682申请日： 2002-12-27
-
公开(公告)号： US06923923B2公开(公告)日： 2005-08-02
- 发明人: Jin Woo Cheon , Sung Nam Cho , Jong Il Park , Kyung Bok Lee , Seok Chang , Soon Taik Hwang
- 申请人： Jin Woo Cheon , Sung Nam Cho , Jong Il Park , Kyung Bok Lee , Seok Chang , Soon Taik Hwang
- 申请人地址： KR Kyungki-Do KR Daejun-Shi
- 专利权人： Samsung Electronics Co., Ltd.,Korea Advanced Institute of Science and Technology
- 当前专利权人： Samsung Electronics Co., Ltd.,Korea Advanced Institute of Science and Technology
- 当前专利权人地址： KR Kyungki-Do KR Daejun-Shi
- 代理机构： Birch, Stewart, Kolasch & Birch, LLP
- 优先权： KR2001-87877 20011229; KR2002-82989 20021224
- 主分类号： B82Y30/00
- IPC分类号： B82Y30/00 ; C09D11/00 ; C09D11/52 ; H01B1/22 ; H01L21/288 ; H01L21/768 ; H05K1/09
摘要：
Disclosed are a metallic nanoparticle cluster ink and a method for forming a conductive metal pattern using the cluster ink. The metallic nanoparticle cluster ink comprises colloidal metallic nanoparticles and a bifunctional compound. The conductive metal pattern is formed by forming a metallic nanoparticle pattern on a substrate using a mold made from PDMS (poly(dimethylsiloxane) polymer as a stamp, and heat-treating the substrate. Micrometer-sized conductive metal patterns can be easily formed on various substrates in a simple and inexpensive manner without the use of costly systems, thereby being very useful in various industrial fields.
公开/授权文献
信息查询
