Invention Grant
- Patent Title: Method of forming a shared global word line MRAM structure
- Patent Title (中): 形成共享全局字线MRAM结构的方法
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Application No.: US10656758Application Date: 2003-09-05
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Publication No.: US06927092B2Publication Date: 2005-08-09
- Inventor: Heon Lee , Fred Perner
- Applicant: Heon Lee , Fred Perner
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agent Brian R. Short
- Main IPC: G11C11/15
- IPC: G11C11/15 ; G11C11/16 ; H01L21/8246 ; H01L27/105 ; H01L43/08 ; H01L21/00

Abstract:
A method of forming a shared global word line MRAM structure is disclosed. The method includes, etching a trench in an oxide layer formed over a substrate, depositing an first liner material, anisotropically etching the deposited first liner material leaving the first liner material on edges of the trench and physically contacting a bottom of the trench, depositing an magnetic metal liner material, anisotropically etching the deposited magnetic metal liner material leaving the magnetic metal liner material over the first liner material on edges of the trench, so that the magnetic metal liner extends to and physically contacts the bottom of the trench, depositing a conductive layer;, and chemically, mechanically polishing the conductive layer.
Public/Granted literature
- US20040047213A1 Shared global word line magnetic random access memory Public/Granted day:2004-03-11
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