Invention Grant
US06927176B2 Cleaning method and solution for cleaning a wafer in a single wafer process
失效
用于在单个晶片工艺中清洁晶片的清洁方法和解决方案
- Patent Title: Cleaning method and solution for cleaning a wafer in a single wafer process
- Patent Title (中): 用于在单个晶片工艺中清洁晶片的清洁方法和解决方案
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Application No.: US09891730Application Date: 2001-06-25
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Publication No.: US06927176B2Publication Date: 2005-08-09
- Inventor: Steven Verhaverbeke , J. Kelly Truman
- Applicant: Steven Verhaverbeke , J. Kelly Truman
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman
- Main IPC: C11D1/29
- IPC: C11D1/29 ; C11D1/72 ; C11D3/02 ; C11D3/04 ; C11D3/30 ; C11D3/32 ; C11D3/33 ; C11D3/39 ; C11D7/06 ; C11D7/18 ; C11D7/26 ; C11D7/32 ; C11D11/00 ; H01L21/00 ; H01L21/304 ; H01L21/306 ; H01L21/302 ; C09K13/00
Abstract:
The present invention is a novel cleaning method and a solution for use in a single wafer cleaning process. According to the present invention the cleaning solution comprises ammonium hydroxide (NH4OH), hydrogen peroxide (H2O2), water (H2O) and a chelating agent. In an embodiment of the present invention the cleaning solution also contains a surfactant. And still yet another embodiment of the present invention the cleaning solution also comprises a dissolved gas such as H2. In a particular embodiment of the present invention, this solution is used by spraying or dispensing it on a spinning wafer.
Public/Granted literature
- US20020102852A1 Cleaning method and solution for cleaning a wafer in a single wafer process Public/Granted day:2002-08-01
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