发明授权
- 专利标题： Cascaded die mountings with spring-loaded contact-bond options
- 专利标题（中）： 带弹簧加载接触键选项的级联模具安装
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申请号： US10738746申请日： 2003-12-17
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公开(公告)号： US06930385B2公开(公告)日： 2005-08-16
- 发明人: John S. Hsu , Donald J. Adams , Gui-Jia Su , Laura D. Marlino , Curtis W. Ayers , Chester Coomer
- 申请人： John S. Hsu , Donald J. Adams , Gui-Jia Su , Laura D. Marlino , Curtis W. Ayers , Chester Coomer
- 申请人地址： US TN Oak Ridge
- 专利权人： UT-Battelle, LLC
- 当前专利权人： UT-Battelle, LLC
- 当前专利权人地址： US TN Oak Ridge
- 代理商 Kirk A. Wilson
- 主分类号： B60H1/00
- IPC分类号： B60H1/00 ; H01L23/44 ; H01L25/065 ; H01L23/34
摘要：
A cascaded die mounting device and method using spring contacts for die attachment, with or without metallic bonds between the contacts and the dies, is disclosed. One embodiment is for the direct refrigerant cooling of an inverter/converter carrying higher power levels than most of the low power circuits previously taught, and does not require using a heat sink.
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