Invention Grant
- Patent Title: Connector interface pad for structurally integrated wiring
- Patent Title (中): 用于结构集成接线的连接器接口板
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Application No.: US10394784Application Date: 2003-03-21
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Publication No.: US06932621B2Publication Date: 2005-08-23
- Inventor: David M. Anderson , David R. Gladish , Robert T. Johnson , Matthew C. Malkin , Simon D. Senibi , Terrance L. Thomas
- Applicant: David M. Anderson , David R. Gladish , Robert T. Johnson , Matthew C. Malkin , Simon D. Senibi , Terrance L. Thomas
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Harness, Dickey & Pierce P.L.C.
- Main IPC: B64C1/00
- IPC: B64C1/00 ; H01R12/51 ; H01R13/46 ; H05K1/11 ; H05K1/18 ; H05K3/00 ; H05K3/34 ; H05K3/42 ; H01R12/00
Abstract:
A connector pad is provided having a base, a top opposite the base, and tapered sidewalls therebetween. The tapering minimizes stress concentrations when the connector pad is bonded into, or on the surface of a structure. The connector pad consists of a plurality of structural load carrying plies suitable for sandwiching a flat structurally integrated wiring array therebetween. A plurality of plated through holes formed in the connector pad enable access to the wiring array therein.
Public/Granted literature
- US20040185688A1 CONNECTOR INTERFACE PAD FOR STRUCTURALLY INTEGRATED WIRING Public/Granted day:2004-09-23
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