发明授权
- 专利标题： Semiconductor device, semiconductor module and hard disk
- 专利标题（中）： 半导体器件，半导体模块和硬盘
-
申请号： US09810117申请日： 2001-03-16
-
公开(公告)号： US06933604B2公开(公告)日： 2005-08-23
- 发明人: Noriaki Sakamoto , Yoshiyuki Kobayashi , Junji Sakamoto , Yukio Okada , Yusuke Igarashi , Eiju Maehara , Kouji Takahashi
- 申请人： Noriaki Sakamoto , Yoshiyuki Kobayashi , Junji Sakamoto , Yukio Okada , Yusuke Igarashi , Eiju Maehara , Kouji Takahashi
- 申请人地址： JP Osaka
- 专利权人： Sanyo Electric Co., Ltd.
- 当前专利权人： Sanyo Electric Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： Fish & Richardson P.C.
- 优先权： JPP.2000-306668 20001005
- 主分类号： H01L23/28
- IPC分类号： H01L23/28 ; H01L21/48 ; H01L23/12 ; H01L23/29 ; H01L23/36 ; H01L23/42 ; H01L23/433 ; H01L25/04 ; H01L25/18 ; H05K1/02 ; H05K1/18 ; H01L23/34 ; H01L23/995 ; H01L921/4763
摘要：
The back surface of a semiconductor chip (16) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to this semiconductor chip (16). The back surface of this metal plate (23) and the back surface of a first supporting member (11) are substantially within a same plane, so that it is readily affixed to a second supporting member (24). Accordingly, the heat generated by the semiconductor chip can be efficiently dissipated via the metal plate (23) and the second supporting member (24).
公开/授权文献
- US20020041021A1 Semiconductor device, semiconductor module and hard disk 公开/授权日：2002-04-11
信息查询
IPC分类:
