发明授权
- 专利标题: Method of manufacturing wireless suspension blank
- 专利标题(中): 制造无线悬挂空白的方法
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申请号: US09813759申请日: 2001-03-21
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公开(公告)号: US06942817B2公开(公告)日: 2005-09-13
- 发明人: Hiroshi Yagi , Shigeki Kawano , Kazuo Umeda , Jiro Takei , Yukio Iimura , Satoshi Sasaki , Katsuya Sakayori , Hiroko Amasaki
- 申请人: Hiroshi Yagi , Shigeki Kawano , Kazuo Umeda , Jiro Takei , Yukio Iimura , Satoshi Sasaki , Katsuya Sakayori , Hiroko Amasaki
- 申请人地址: JP Tokyo
- 专利权人: Dainippon Printing Co., Ltd.
- 当前专利权人: Dainippon Printing Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Flynn, Thiel, Boutell & Tanis, P.C.
- 优先权: JP2000-085045 20000324; JP2000-206195 20000707; JP2000-206196 20000707
- 主分类号: G11B5/48
- IPC分类号: G11B5/48 ; H05K1/05 ; H05K3/00 ; H05K3/06 ; H05K3/10 ; B44C1/22 ; C03C15/00 ; C03C25/68 ; C23F1/00 ; G11B21/16
摘要:
A wireless suspension blank is made using a two-layer laminate composed of a metallic layer with the spring property and an electrically insulating layer. The first method includes a first step for working the metallic layer by the photo etching method, a second step for forming a wiring part on the insulating layer by the semi-additive method and a third step for working the insulating layer by the wet-etching method. The second method includes a first step for working the metallic layer by the photo etching method, a second step for forming a wiring part on the insulating layer by the semi-additive method and a third step for working the insulating layer by the plasma etching method. The third method includes a first step for forming a wiring part on the metallic layer by the semi-additive method, a second step for working the metallic layer by the wet-etching method and a third step for working the insulating layer by the dry-etching method or the wet-etching method. The use of a two-layer laminate makes possible a low cost production. Further, the forming of a wiring part by the semi-additive method makes possible to working very accurately a fine wiring part.
公开/授权文献
- US20020027127A1 Method of manufacturing wireless suspension blank 公开/授权日:2002-03-07
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