Invention Grant
- Patent Title: Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
- Patent Title (中): 在晶片衬底上沉积，释放和封装微机电器件的方法
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Application No.: US10005308Application Date: 2001-12-03
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Publication No.: US06969635B2Publication Date: 2005-11-29
- Inventor: Satyadev R. Patel , Andrew G. Huibers , Steven S. Chiang
- Applicant: Satyadev R. Patel , Andrew G. Huibers , Steven S. Chiang
- Applicant Address: US CA Sunnyvale
- Assignee: Reflectivity, Inc.
- Current Assignee: Reflectivity, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agent Gregory R. Muir
- Main IPC: B81B3/00
- IPC: B81B3/00 ; B81B7/00 ; B81C1/00 ; B81C99/00 ; G02B26/08 ; H01L21/44
Abstract:
A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.
Public/Granted literature
- US20030054588A1 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates Public/Granted day:2003-03-20
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