公开(公告)号：US06969635B2

公开(公告)日：2005-11-29

申请号：US10005308

申请日：2001-12-03

申请人： Satyadev R. Patel ,  Andrew G. Huibers ,  Steven S. Chiang

发明人： Satyadev R. Patel ,  Andrew G. Huibers ,  Steven S. Chiang

IPC分类号： B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  B81C99/00 ,  G02B26/08 ,  H01L21/44

CPC分类号： B81C1/00214 ,  B81B7/0077 ,  B81B2201/042 ,  B81C1/00333 ,  B81C1/00896 ,  B81C1/00904 ,  B81C2203/0118 ,  B82Y30/00 ,  G02B26/0833 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/01054 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.

摘要翻译： 公开了一种用于形成MEMS器件的方法，其中在晶片接合步骤之前执行最终释放步骤以保护MEMS器件免受污染，物理接触或其它有害的外部事件。 除了可选的静态处理之外，在释放和晶片接合和分离之间的MEMS结构没有额外的变化的情况下，MEMS器件是最佳保护的并且整个工艺流程得到改善。 该方法适用于任何MEMS器件的生产，并且特别有利于制造易碎的微镜。