发明授权
US06973634B1 IC layouts with at least one layer that has more than one preferred interconnect direction, and method and apparatus for generating such a layout
失效
具有至少一个具有多于一个优选互连方向的层的IC布局，以及用于生成这样的布局的方法和装置
- 专利标题： IC layouts with at least one layer that has more than one preferred interconnect direction, and method and apparatus for generating such a layout
- 专利标题（中）： 具有至少一个具有多于一个优选互连方向的层的IC布局，以及用于生成这样的布局的方法和装置
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申请号： US10228736申请日： 2002-08-26
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公开(公告)号： US06973634B1公开(公告)日： 2005-12-06
- 发明人: Steven Teig , Andrew Caldwell , Etienne Jacques
- 申请人： Steven Teig , Andrew Caldwell , Etienne Jacques
- 申请人地址： US CA San Jose
- 专利权人： Cadence Design Systems, Inc.
- 当前专利权人： Cadence Design Systems, Inc.
- 当前专利权人地址： US CA San Jose
- 代理机构： Stattler, Johansen and Adeli LLP
- 主分类号： G06F17/50
- IPC分类号： G06F17/50 ; H01L23/528 ; H01L25/00 ; H03K19/173
摘要：
Some embodiments of the invention provide a region of an integrated-circuit (“IC”) layout that has a plurality of interconnect layers, where at least one particular layer has more than one preferred interconnect direction. In some of these embodiments, the region has several interconnect layers that have more than one preferred wiring direction each.
公开/授权文献
- US2108306A Slicing machine 公开/授权日：1938-02-15
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