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发明授权
US06973801B1 Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack 有权
在电子机架的电子子系统内使用闭环冷却剂路径和微型冷却结构的冷却系统和方法

Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack
摘要：
A cooling approach is provided for one or more subsystems of an electronics rack. The cooling approach employs a coolant distribution unit and a thermal dissipation unit. The coolant distribution unit has a first heat exchanger, a first cooling loop and a second cooling loop. The first cooling loop passes facility coolant through the first heat exchanger, and the second cooling loop provides system coolant to an electronics subsystem, and expels heat in the first heat exchanger from the subsystem to the facility coolant. The thermal dissipation unit is associated with the electronics subsystem and includes a second heat exchanger, the second cooling loop, and a third cooling loop. The second cooling loop provides system coolant to the second heat exchanger, and the third cooling loop circulates conditioned coolant within the electronics subsystem and expels heat in the second heat exchanger from the electronics subsystem to the system coolant.
摘要（中）：

为电子机架的一个或多个子系统提供冷却方法。 冷却方式采用冷却液分配单元和散热单元。 冷却剂分配单元具有第一热交换器，第一冷却回路和第二冷却回路。 第一冷却回路使设备冷却剂通过第一热交换器，并且第二冷却回路将系统冷却剂提供给电子子系统，并将第一热交换器中的热量从子系统排出到设备冷却剂。 散热单元与电子子系统相关联并且包括第二热交换器，第二冷却回路和第三冷却回路。 第二冷却回路为第二热交换器提供系统冷却剂，第三冷却回路将调节后的冷却剂循环在电子子系统内，并将第二热交换器中的热量从电子系统排出到系统冷却剂。

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