发明授权
- 专利标题: Wafer probe station for low-current measurements
- 专利标题(中): 晶圆探针台进行低电流测量
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申请号: US10678549申请日: 2003-10-02
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公开(公告)号: US06980012B2公开(公告)日: 2005-12-27
- 发明人: Randy J. Schwindt , Warren K. Harwood , Paul A. Tervo , Kenneth R. Smith , Richard H. Warner
- 申请人: Randy J. Schwindt , Warren K. Harwood , Paul A. Tervo , Kenneth R. Smith , Richard H. Warner
- 申请人地址: US OR Beaverton
- 专利权人: Cascase Microtech, Inc.
- 当前专利权人: Cascase Microtech, Inc.
- 当前专利权人地址: US OR Beaverton
- 代理机构: Chernoff Vilhauer McClung & Stenzel LLP
- 主分类号: H01L21/66
- IPC分类号: H01L21/66 ; A46D1/00 ; G01R1/067 ; G01R1/073 ; G01R31/02 ; G01R31/28 ; H01L21/687
摘要:
A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times. With similar operation and effect, where any signal line element of the connector mechanism is arranged exterior of its corresponding guard line element, such as adjacent the chuck assembly or on the probe-holding assembly, a guard enclosure is provided to surround and fully guard such signal line element in interposed relationship between that element and the outer shielding enclosure.
公开/授权文献
- US20040061514A1 Wafer probe station for low-current measurements 公开/授权日:2004-04-01
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