Invention Grant
- Patent Title: Plasma processing method and plasma processing apparatus
- Patent Title (中): 等离子体处理方法和等离子体处理装置
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Application No.: US11055612Application Date: 2005-02-11
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Publication No.: US06985215B2Publication Date: 2006-01-10
- Inventor: Hin Oh , Hideaki Sato , Naoki Takayama , Hisanori Sakai , Yuichi Mimura
- Applicant: Hin Oh , Hideaki Sato , Naoki Takayama , Hisanori Sakai , Yuichi Mimura
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- Priority: JP2002-235942 20020813; JP2002-235973 20020813
- Main IPC: H01L21/3065
- IPC: H01L21/3065 ; G01J3/28 ; G01J3/30
Abstract:
In a plasma processing method and apparatus for monitoring information on a plasma processing, a multivariate analysis is performed by using as analysis data detection values detected for each object to be processed from a plurality of detection devices disposed in the processing apparatus upon the plasma processing. At that time, for each of sections defined whenever a maintenance of the processing apparatus is carried out, the detection values detected by the detection devices in the respective sections are compensated through a compensation unit, and the compensated detection values are taken as the analysis data.
Public/Granted literature
- US20050146709A1 Plasma processing method and plasma processing apparatus Public/Granted day:2005-07-07
Information query
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