发明授权
- 专利标题： Conformal barrier liner in an integrated circuit interconnect
- 专利标题（中）： 集成电路互连中的保形阻挡衬垫
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申请号： US10672103申请日： 2003-09-26
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公开(公告)号： US06989604B1公开(公告)日： 2006-01-24
- 发明人: Christy Mei-Chu Woo , Minh Van Ngo , John E. Sanchez, Jr. , Steven C. Avanzino
- 申请人： Christy Mei-Chu Woo , Minh Van Ngo , John E. Sanchez, Jr. , Steven C. Avanzino
- 申请人地址： US CA Sunnyvale
- 专利权人： Advanced Micro Devices, Inc.
- 当前专利权人： Advanced Micro Devices, Inc.
- 当前专利权人地址： US CA Sunnyvale
- 代理商 Mikio Ishimaru
- 主分类号： H01L23/52
- IPC分类号： H01L23/52
摘要：
An integrated circuit having a substrate and a semiconductor device thereon. A stop layer over the substrate has a first dielectric layer formed thereon having an opening into which a first conformal barrier is formed. A first conformal barrier liner is formed in the opening, processed, and treated to improve adhesion. Portions of the first conformal barrier liner on the sidewalls act as a barrier to diffusion of conductor core material to the first dielectric layer. A conductor material is formed in the opening over the vertical portions of the first conformal barrier liner and the first stop layer.
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