Invention Grant
- Patent Title: Photodetector integratable light coupling apparatus
- Patent Title (中): 光电检测器可整合光耦合装置
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Application No.: US10803885Application Date: 2004-03-19
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Publication No.: US06992360B2Publication Date: 2006-01-31
- Inventor: In Gyoo Kim , Gyung Ock Kim
- Applicant: In Gyoo Kim , Gyung Ock Kim
- Applicant Address: KR Daejon-Shi
- Assignee: Electronics and Telecommunications Research Institute
- Current Assignee: Electronics and Telecommunications Research Institute
- Current Assignee Address: KR Daejon-Shi
- Agency: Mayer, Brown, Rowe & Maw LLP
- Priority: KR10-2003-0085550 20031128
- Main IPC: H01L31/0232
- IPC: H01L31/0232
Abstract:
Provided is a light coupling apparatus that forms an etch structure complex comprising a total reflection surface/an anti-reflection surface within a substrate to improve coupling efficiency with incident light and responsivity of a photodetector device, whereby a surface-illuminated photodetector or an edge-coupled photodetector are all integratable, and it is possible to reduce the degree of difficulty during packaging and to improve the responsivity of the photodetector at low costs.
Public/Granted literature
- US20050116311A1 Photodetector integratable light coupling apparatus Public/Granted day:2005-06-02
Information query
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