A RFIC includes a die and a package. The die contains a radio frequency (RF) input/output (I/O) section, an RF-to-baseband conversion section, and a baseband processing section. The package includes a plurality of connections for connecting to the die. The die is positioned within the package to minimize adverse affects of parasitics components of coupling the RFIO section to an antenna. The positioning of the die within the package may be offset from the center of the package and/or positioned at the edge of the package.