发明授权
US07005359B2 Bipolar junction transistor with improved extrinsic base region and method of fabrication
失效
具有改进的外在基极区域的双极结晶体管及其制造方法
- 专利标题: Bipolar junction transistor with improved extrinsic base region and method of fabrication
- 专利标题(中): 具有改进的外在基极区域的双极结晶体管及其制造方法
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申请号: US10715971申请日: 2003-11-17
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公开(公告)号: US07005359B2公开(公告)日: 2006-02-28
- 发明人: Shahriar Ahmed , Ravindra Soman , Anand Murthy , Mark Bohr
- 申请人: Shahriar Ahmed , Ravindra Soman , Anand Murthy , Mark Bohr
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号: H01L21/331
- IPC分类号: H01L21/331
摘要:
A bipolar transistor and its fabrication are described. The extrinsic base region is formed by growing a second, more heavily doped, epitaxial layer over a first epitaxial layer. The second layer extends under, and is insulated from, an overlying polysilicon emitter pedestal.
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