Invention Grant
US07008730B2 Application of high transmittance attenuating phase shifting mask with dark tone for sub-0.1 micrometer logic device contact hole pattern in 193 NM lithography
有权
在193 NM光刻中应用具有暗色调的高透光率衰减相移掩模,用于亚-0.1微米逻辑器件接触孔图案
- Patent Title: Application of high transmittance attenuating phase shifting mask with dark tone for sub-0.1 micrometer logic device contact hole pattern in 193 NM lithography
- Patent Title (中): 在193 NM光刻中应用具有暗色调的高透光率衰减相移掩模,用于亚-0.1微米逻辑器件接触孔图案
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Application No.: US10338118Application Date: 2003-01-07
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Publication No.: US07008730B2Publication Date: 2006-03-07
- Inventor: Cheng-Ming Lin
- Applicant: Cheng-Ming Lin
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Thomas, Kayden, Horstemeyer & Risley
- Main IPC: G03F9/00
- IPC: G03F9/00 ; G03C5/00

Abstract:
An attenuating phase shifting mask for forming contact holes in a layer of negative resist, a method of forming the mask, and a method of forming the contact holes are described. The mask is formed from a mask blank having a layer of attenuating phase shifting material formed on a transparent mask blank. The attenuating phase shifting material has a transmittance of greater than 20% and between about 20% and 50% for light having a wavelength of 193 nanometers. The mask is a dark tone mask having mask elements formed of the attenuating phase shifting material at the locations of the mask corresponding to the locations of the contact holes. The mask is used to expose a layer of negative resist which is then developed to form the contact holes.
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