发明授权
- 专利标题: Polyamide composition
- 专利标题(中): 聚酰胺组合物
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申请号: US10464474申请日: 2003-06-19
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公开(公告)号: US07009029B2公开(公告)日: 2006-03-07
- 发明人: Hideaki Oka , Hideharu Matsuoka , Toru Kuki
- 申请人: Hideaki Oka , Hideharu Matsuoka , Toru Kuki
- 申请人地址: JP Kurashiki
- 专利权人: Kuraray Co., Ltd.
- 当前专利权人: Kuraray Co., Ltd.
- 当前专利权人地址: JP Kurashiki
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- 优先权: JP2002-181283 20020621
- 主分类号: C08G69/26
- IPC分类号: C08G69/26 ; C08K3/00 ; C08L77/00 ; C08L3/22
摘要:
Provided is a polyamide composition comprising 100 parts by weight of (A) a polyamide having dicarboxylic acid units containing 60 to 100 mol % of terephthalic acid units, and diamine units containing 60 to 100 mol % of 1,9-nonanediamine units and/or 2-methyl-1,8-octanediamine units, and 5 to 100 parts by weight of (B) a titanium oxide with an average particle size of 0.1 to 0.5 μm. The polyamide composition shows excellent heat resistance enough to withstand the SMT process, and gives a molded article with excellent whiteness and surface-reflectance.
公开/授权文献
- US20040034152A1 Polyamide composition 公开/授权日:2004-02-19