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发明授权
US07009287B2 Chip on photosensitive device package structure and electrical connection thereof 失效
芯片上的感光器件封装结构及其电气连接

Chip on photosensitive device package structure and electrical connection thereof
摘要：
A chip on photosensitive device package structure is provided. The package mainly comprises a photosensitive device, a transparent plate and a chip. The photosensitive device has an illumination area and a non-illumination area. The transparent plate has a first surface and a corresponding second surface. The transparent plate is set over the photosensitive device with the first surface covering both the illumination area and the non-illumination area. The chip is set on the second surface of the transparent plate above the non-illumination area of the photosensitive device.
摘要（中）：

提供了一种感光器件封装结构的芯片。 封装主要包括光敏元件，透明板和芯片。 感光装置具有照明区域和非照明区域。 透明板具有第一表面和相应的第二表面。 透明板设置在感光装置上，第一表面覆盖照明区域和非照明区域。 芯片设置在感光装置的非照明区域上方的透明板的第二表面上。

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