Abstract:
A pointing device includes two lenses with wide and narrow view angles respectively. In a short distance range, the pointing device utilizes the lens with wide view angle to increase visible range. In a long distance range, the pointing device utilizes the lens with narrow view angle to increase size of a formed image of a reference point. In addition, the pointing device senses images through both of the lenses with wide and narrow view angles to obtain rotational information. The pointing device can provide not only positional information but also angular information.
Abstract:
A control device of a temperature controller, for adjusting the temperature of an environment having at least one active object, includes a first image sensor, a second image sensor, a process unit and a control unit. The first image sensor is for capturing a first image containing the image of the active object. The second image sensor is for capturing a second image containing the image of the active object. The process unit calculates a distance between the active object and the temperature controller according to the first and second images. The control unit controls an operational status of the temperature controller according to the distance calculated by the process unit. The present invention further provides a control method of a temperature controller
Abstract:
The present invention provides a QFN package structure, comprising a chip carrier and at least a chip. The chip is disposed on the top surface of the chip carrier, while the back surface of the chip carrier includes a plurality of flat no-lead conductive leads as I/O pads of the chip carrier for the external circuitry. A plurality of pads, corresponding to bonding pads of the chip, is disposed on the top surface of the chip carrier. The aforementioned package structure can employ wiring bonding technology, flip chip technology or surface mount technology to attach the chip to the chip carrier.
Abstract:
A process for fabricating a semiconductor device is provided. The process integrates a cutting film process into the front-end of semiconductor process. The cutting film is directly formed on the curved surface of the micro-lens or a passivation layer is formed on the micro-lens before covering the passivation layer with the cutting film. In addition to micro-particle contamination due to sawing, the process is able to simplify chip packaging and reduce the size of a photosensitive module.
Abstract:
An image sensor comprising an image sensing device layer, a silicon-on-insulator (SOI) layer, an optical device array and a substrate is provided. The SOI layer has a first surface and a second surface. The image sensing device layer is formed on the first surface of the SOI layer. The optical device array is formed on the second surface of the SOI layer. The substrate is disposed above the second surface of the SOI layer and the optical device array is disposed between the substrate and the SOI layer. An incident light coming from the outside environment, passes through the optical device array and the SOI layer, and is received by sensing devices formed in the image sensing device layer. In this manner, the probability of absorption or reflection of the incident light is reduced. Therefore, the sensing performance and the yield of the image sensor of the present invention is improved.
Abstract:
A camera module is provided. The camera module comprises: a lens; a holder having a lower portion, the holder holding the lens; a circuit board; and an image sensing and processing unit including an image sensing device and an optional signal processing device stacked on and electrically connected to the image sensing device, the image sensing and processing unit being packaged on one side of the circuit board; wherein the holder is fixed on the circuit board, the image sensing and processing unit inside the lower portion of the holder. Further, if the circuit board is a flexible circuit board, then a hard plate can be disposed on the other side of the flexible PCB corresponding to the image sensing and processing unit in order to enhance the mechanical strength.
Abstract:
A process for fabricating a semiconductor device is provided. The process integrates a cutting film process into the front-end of semiconductor process. The cutting film is directly formed on the curved surface of the micro-lens or a passivation layer is formed on the micro-lens before covering the passivation layer with the cutting film. In addition to micro-particle contamination due to sawing, the process is able to simplify chip packaging and reduce the size of a photosensitive module.
Abstract:
A process for fabricating a semiconductor device is provided. The process integrates a cutting film process into the front-end of semiconductor process. The cutting film is directly formed on the curved surface of the micro-lens or a passivation layer is formed on the micro-lens before covering the passivation layer with the cutting film. In addition to micro-particle contamination due to sawing, the process is able to simplify chip packaging and reduce the size of a photosensitive module.
Abstract:
A control device of a temperature controller, for adjusting the temperature of an environment having at least one active object, includes a first image sensor, a second image sensor, a process unit and a control unit. The first image sensor is for capturing a first image containing the image of the active object. The second image sensor is for capturing a second image containing the image of the active object. The process unit calculates a distance between the active object and the temperature controller according to the first and second images. The control unit controls an operational status of the temperature controller according to the distance calculated by the process unit. The present invention further provides a control method of a temperature controller.
Abstract:
An electronic apparatus with a virtual data input device includes a first body, a second body, a sensing plane, an image sensing module and a processor. A display is disposed on the second body. The sensing plane is disposed on the first body and configured for generating an initiating signal when a user presses the sensing plane. The image sensing module is disposed on the second body and configured for sensing the pressing action on the sensing plane by the user and generating an image signal that carries the information of the pressed position on the sensing plane. The processor is electrically connected with the sensing plane and the image sensing module, and configured for processing the image signal after the initiating signal is generated so that data corresponding to the pressing action of the user is input to the electronic apparatus.