发明授权
US07016557B2 Optical chip and method for producing an optical chip having a reinforced structure
失效
光学芯片及具有加强结构的光学芯片的制造方法
- 专利标题： Optical chip and method for producing an optical chip having a reinforced structure
- 专利标题（中）： 光学芯片及具有加强结构的光学芯片的制造方法
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申请号： US10380445申请日： 2001-09-12
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公开(公告)号： US07016557B2公开(公告)日： 2006-03-21
- 发明人: Bernhard A. Deutsch , Angela Rief , Wolfgang Schweiker , Frank Zimmer
- 申请人： Bernhard A. Deutsch , Angela Rief , Wolfgang Schweiker , Frank Zimmer
- 申请人地址： US NY Corning
- 专利权人： Corning Incorporated
- 当前专利权人： Corning Incorporated
- 当前专利权人地址： US NY Corning
- 代理商 Walter M. Douglas
- 优先权： DE10045566 20000914
- 国际申请： PCT/DE01/03500 WO 20010912
- 国际公布： WO02/23238 WO 20020321
- 主分类号： G02B6/12
- IPC分类号： G02B6/12
摘要：
The invention relates to an optical chip and to a method for producing an optical chip having a reinforced structure. The chip has a substrate, optical waveguides arranged on the surface of said substrate, and at least one optical structure for influencing the optical properties of the optical waveguides, and an interconnected laminar reinforcing or stiffening structure constructed in the form of a cross which is arranged centrally on the substrate with the provision of diametrically opposite cut-outs.
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